IEEE Std P1838: 3D test access standard under development

Adam Cron, Erik Jan Marinissen, Sandeep K. Goel, Teresa McLaurin, Sandeep Bhatia

Research output: Chapter in Book/Report/Conference proceedingChapterAcademicpeer-review

Abstract

IEEE Std P1838 is striving to implement a flexible architecture, allowing access to die‐level DfT structures embedded within a stack of die. Access to these structures should be available at the die level, through all levels of manufacturing as each die is stacked upon the next, and finally at the package level.
Original languageEnglish
Title of host publicationHandbook of 3D integration
Subtitle of host publicationvolume 4: design, test, and thermal management
EditorsP.D. Franzon, E.J. Marinissen, M.S. Bakir
Place of PublicationWeinheim
PublisherWiley-VCH Verlag
Chapter14
Pages301-323
Number of pages23
ISBN (Print)978-3-527-33855-9
DOIs
Publication statusPublished - 8 Feb 2019

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