IEEE Std 1500 compliant infrastructure for modular SOC testing

T.F. Waayers; E.J. Marinissen; M. Lousberg

doi:10.1109/ATS.2005.67

IEEE Std 1500 compliant infrastructure for modular SOC testing

T.F. Waayers, E.J. Marinissen, M. Lousberg

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Academic › peer-review

5 Citations (Scopus)

Abstract

Modern semiconductor process technologies enable the manufacturing of a complete system on one single die, the so-called system-on-chip or SOC. Building those chips in a timely and cost-effective manner is amongst others realized by embedding third-party IP cores. Due to imperfections in silicon manufacturing, an SOC including all its embedded modules needs to be tested for manufacturing defects.

Original language	English
Title of host publication	14th Asian Test Symposium (ATS'05)
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	450-450
ISBN (Print)	0-7695-2481-8
DOIs	https://doi.org/10.1109/ATS.2005.67
Publication status	Published - 2005
Externally published	Yes
Event	14th Asian Test Symposium (ATS 2005) - Calcutta, India Duration: 18 Dec 2005 → 21 Dec 2005 Conference number: 14

Conference

Conference	14th Asian Test Symposium (ATS 2005)
Abbreviated title	ATS 2005
Country/Territory	India
City	Calcutta
Period	18/12/05 → 21/12/05

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10.1109/ATS.2005.67

Cite this

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title = "IEEE Std 1500 compliant infrastructure for modular SOC testing",

abstract = "Modern semiconductor process technologies enable the manufacturing of a complete system on one single die, the so-called system-on-chip or SOC. Building those chips in a timely and cost-effective manner is amongst others realized by embedding third-party IP cores. Due to imperfections in silicon manufacturing, an SOC including all its embedded modules needs to be tested for manufacturing defects.",

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AU - Marinissen, E.J.

AU - Lousberg, M.

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AB - Modern semiconductor process technologies enable the manufacturing of a complete system on one single die, the so-called system-on-chip or SOC. Building those chips in a timely and cost-effective manner is amongst others realized by embedding third-party IP cores. Due to imperfections in silicon manufacturing, an SOC including all its embedded modules needs to be tested for manufacturing defects.

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DO - 10.1109/ATS.2005.67

M3 - Chapter

SN - 0-7695-2481-8

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CY - Piscataway

T2 - 14th Asian Test Symposium (ATS 2005)

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ER -

IEEE Std 1500 compliant infrastructure for modular SOC testing

Abstract

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