Hybrid Photonic Integration for Optical Switches

Wenjing Tian, Kevin A. Williams, Ronald Dekker, Joost van Kerkhof, Lucas Beste, Xaveer J.M. Leijtens

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Abstract

This invited paper reviews the state-of-the-art hybrid photonic integration technologies for optical switches, with a particular emphasis on the advantages of integrating diverse materials, notably indium phosphide and silicon nitride. We highlight progress in various aspects of hybrid photonic integration including achieving high-port-count fiber-chip coupling, facilitating high-density electrical interfaces, and enabling on-chip temperature sensing and control. This paper also provides insights into the potential of hybrid photonic integration in shaping the future of optical switches.
Original languageEnglish
Title of host publication2023 International Conference on Photonics in Switching and Computing (PSC)
PublisherInstitute of Electrical and Electronics Engineers
Pages1-3
Number of pages3
ISBN (Electronic)979-8-3503-2370-2
DOIs
Publication statusPublished - 2 Nov 2023
Event2023 International Conference on Photonics in Switching and Computing, PSC 2023 - Mantova, Italy
Duration: 26 Sept 202329 Sept 2023

Conference

Conference2023 International Conference on Photonics in Switching and Computing, PSC 2023
Abbreviated titlePSC 2023
Country/TerritoryItaly
CityMantova
Period26/09/2329/09/23

Funding

European Union and Microsoft Research are acknowledged for financial support through the Eurostars FLEXFIX program nr.2018.29, Ph.D. Scholarship Programme, and Optics for the Could project.

FundersFunder number
Microsoft Research
Eurostars
European Commission

    Keywords

    • Optical switches
    • fiber-chip coupling
    • indium phosphide
    • photonic integrated circuits
    • semiconductor optical amplifiers
    • silicon nitride

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