How to model and simulate a wafer processing facility : models and simulations using the Process-Interacting Approach (PIA) can help a fab stay competitive

B. Denekamp; J.E. Rooda; A.M. Wortmann; G.H. Smit

How to model and simulate a wafer processing facility : models and simulations using the Process-Interacting Approach (PIA) can help a fab stay competitive

B. Denekamp, J.E. Rooda, A.M. Wortmann, G.H. Smit

Research output: Contribution to journal › Article › Popular

Original language	English
Pages (from-to)	108-111
Journal	Semiconductor international
Issue number	sept
Publication status	Published - 1990

Cite this

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title = "How to model and simulate a wafer processing facility : models and simulations using the Process-Interacting Approach (PIA) can help a fab stay competitive",

author = "B. Denekamp and J.E. Rooda and A.M. Wortmann and G.H. Smit",

year = "1990",

language = "English",

pages = "108--111",

journal = "Semiconductor international",

issn = "0163-3767",

publisher = "Reed Business",

number = "sept",

}

TY - JOUR

T1 - How to model and simulate a wafer processing facility : models and simulations using the Process-Interacting Approach (PIA) can help a fab stay competitive

AU - Denekamp, B.

AU - Rooda, J.E.

AU - Wortmann, A.M.

AU - Smit, G.H.

PY - 1990

Y1 - 1990

M3 - Article

SN - 0163-3767

SP - 108

EP - 111

JO - Semiconductor international

JF - Semiconductor international

IS - sept

ER -