Abstract
We present a thin-film dual-layer bottom barrier on polyimide that is compatible with 350°C backplane processing for organic light-emitting diode displays and that can facilitate foldable active-matrix organic light-emitting diode devices with a bending radius of <2 mm. We demonstrate organic light-emitting diodes that survive bending over 0.5 mm radius for 10.000× based on the high-temperature bottom barrier. Furthermore, we show compatibility of the bottom barrier with the backplane process by fabricating active-matrix organic light-emitting diode displays on GEN1-sized substrates.
Original language | English |
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Pages (from-to) | 214-222 |
Number of pages | 9 |
Journal | Journal of the Society for Information Display |
Volume | 26 |
Issue number | 4 |
DOIs | |
Publication status | Published - 1 Apr 2018 |
Keywords
- AMOLED displays
- foldable
- high temperature
- thin-film barrier