High-speed RF interconnects beyond 67 GHz in InP photonic integration technology

Weiming Yao; Victor Dolores-Calzadilla; Tjibbe de Vries; Kevin Williams

doi:10.23919/PS.2019.8817728

High-speed RF interconnects beyond 67 GHz in InP photonic integration technology

Photonic Integration

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

2 Citations (Scopus)

3 Downloads (Pure)

Abstract

We developed an RF interconnect technology as a post-process for standard InP photonic integrated circuits and measured 50 GHz bandwidth on n-doped and >67 GHz on semi-insulating substrates with open eye diagrams at 56 Gb/s.

Original language	English
Title of host publication	OECC/PSC 2019 - 24th OptoElectronics and Communications Conference/International Conference Photonics in Switching and Computing 2019
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Number of pages	3
ISBN (Electronic)	978-4-88552-321-2
DOIs	https://doi.org/10.23919/PS.2019.8817728
Publication status	Published - 1 Jul 2019
Event	24th Optoelectronics and Communications Conference, OECC 2019/ International Conference on Photonics in Switching and Computing, PSC 2019 - Fukuoka, Japan Duration: 7 Jul 2019 → 11 Jul 2019 Conference number: 24 https://www.oeccpsc2019.org/

Conference

Conference	24th Optoelectronics and Communications Conference, OECC 2019/ International Conference on Photonics in Switching and Computing, PSC 2019
Abbreviated title	OECC/PSC 2019
Country/Territory	Japan
City	Fukuoka
Period	7/07/19 → 11/07/19
Internet address	https://www.oeccpsc2019.org/

Funding

We acknowledge the Dutch Stimulus OPZuid programme through the Open Innovation Photonic ICs project (PROJ-00315) for supporting this work.

Keywords

Photonic integrated circuits
Photonics-Electronics integration

Access to Document

10.23919/PS.2019.8817728

Cite this

Yao, W., Dolores-Calzadilla, V., de Vries, T., & Williams, K. (2019). High-speed RF interconnects beyond 67 GHz in InP photonic integration technology. In OECC/PSC 2019 - 24th OptoElectronics and Communications Conference/International Conference Photonics in Switching and Computing 2019 Article 8817728 Institute of Electrical and Electronics Engineers. https://doi.org/10.23919/PS.2019.8817728

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title = "High-speed RF interconnects beyond 67 GHz in InP photonic integration technology",

abstract = "We developed an RF interconnect technology as a post-process for standard InP photonic integrated circuits and measured 50 GHz bandwidth on n-doped and >67 GHz on semi-insulating substrates with open eye diagrams at 56 Gb/s.",

keywords = "Photonic integrated circuits, Photonics-Electronics integration",

author = "Weiming Yao and Victor Dolores-Calzadilla and \{de Vries\}, Tjibbe and Kevin Williams",

year = "2019",

month = jul,

day = "1",

doi = "10.23919/PS.2019.8817728",

language = "English",

booktitle = "OECC/PSC 2019 - 24th OptoElectronics and Communications Conference/International Conference Photonics in Switching and Computing 2019",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "24th Optoelectronics and Communications Conference, OECC 2019/ International Conference on Photonics in Switching and Computing, PSC 2019, OECC/PSC 2019 ; Conference date: 07-07-2019 Through 11-07-2019",

url = "https://www.oeccpsc2019.org/",

}

Yao, W , Dolores-Calzadilla, V, de Vries, T & Williams, K 2019, High-speed RF interconnects beyond 67 GHz in InP photonic integration technology. in OECC/PSC 2019 - 24th OptoElectronics and Communications Conference/International Conference Photonics in Switching and Computing 2019., 8817728, Institute of Electrical and Electronics Engineers, Piscataway, 24th Optoelectronics and Communications Conference, OECC 2019/ International Conference on Photonics in Switching and Computing, PSC 2019, Fukuoka, Japan, 7/07/19. https://doi.org/10.23919/PS.2019.8817728

High-speed RF interconnects beyond 67 GHz in InP photonic integration technology. / Yao, Weiming ; Dolores-Calzadilla, Victor; de Vries, Tjibbe et al.
OECC/PSC 2019 - 24th OptoElectronics and Communications Conference/International Conference Photonics in Switching and Computing 2019. Piscataway: Institute of Electrical and Electronics Engineers, 2019. 8817728.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - High-speed RF interconnects beyond 67 GHz in InP photonic integration technology

AU - Yao, Weiming

AU - Dolores-Calzadilla, Victor

AU - de Vries, Tjibbe

AU - Williams, Kevin

N1 - Conference code: 24

PY - 2019/7/1

Y1 - 2019/7/1

N2 - We developed an RF interconnect technology as a post-process for standard InP photonic integrated circuits and measured 50 GHz bandwidth on n-doped and >67 GHz on semi-insulating substrates with open eye diagrams at 56 Gb/s.

AB - We developed an RF interconnect technology as a post-process for standard InP photonic integrated circuits and measured 50 GHz bandwidth on n-doped and >67 GHz on semi-insulating substrates with open eye diagrams at 56 Gb/s.

KW - Photonic integrated circuits

KW - Photonics-Electronics integration

UR - https://www.scopus.com/pages/publications/85072334648

U2 - 10.23919/PS.2019.8817728

DO - 10.23919/PS.2019.8817728

M3 - Conference contribution

BT - OECC/PSC 2019 - 24th OptoElectronics and Communications Conference/International Conference Photonics in Switching and Computing 2019

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

T2 - 24th Optoelectronics and Communications Conference, OECC 2019/ International Conference on Photonics in Switching and Computing, PSC 2019

Y2 - 7 July 2019 through 11 July 2019

ER -

Yao W , Dolores-Calzadilla V, de Vries T, Williams K. High-speed RF interconnects beyond 67 GHz in InP photonic integration technology. In OECC/PSC 2019 - 24th OptoElectronics and Communications Conference/International Conference Photonics in Switching and Computing 2019. Piscataway: Institute of Electrical and Electronics Engineers. 2019. 8817728 doi: 10.23919/PS.2019.8817728

High-speed RF interconnects beyond 67 GHz in InP photonic integration technology

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Keywords

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