High-rate electrochemical copper deposition on bars

L.J.J. Janssen

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    The industrial electrodeposition of copper from cupric acid sulphate baths is typically carried out at approximately 3 kA m–2. A much higher rate of copper deposition is necessary to improve this electroplating process significantly. To achieve this higher rate for the deposition of copper on a round bar, the solution flow is directed normal to the axis of a round bar. The current efficiency Cu for copper deposition on a round bar, 9 mm in diameter, has been determined from 1 M H2SO4+1 M CuSO4 bath as a function of current density, solution flow rate and temperature. A set of relations has been proposed for calculating the current efficiency Cu for a broad range of parameters.
    Original languageEnglish
    Pages (from-to)339-346
    JournalJournal of Applied Electrochemistry
    Issue number3
    Publication statusPublished - 1988


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