High Power GaN Module Using 3D-Printed Liquid Coolers for Hard-Switching at Megahertz

B.P. (Pelle) Weiler; Bas J.D. Vermulst; Erik Lemmen; C.G.E. (Korneel) Wijnands

High Power GaN Module Using 3D-Printed Liquid Coolers for Hard-Switching at Megahertz

B.P. (Pelle) Weiler, Bas J.D. Vermulst, Erik Lemmen, C.G.E. (Korneel) Wijnands

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Abstract

This work presents a power module for high frequency operation, designed to get the maximum performance out of Gallium-Nitride (GaN) devices. The use of metal 3D-printed liquid coolers, ceramic insulation and advanced Indium interface material leads to extremely low thermal resistance and low parasitic impact on switching performance. The presented module consists of four half-bridges, rated for 400 V and output currents of 15 A. The thermal interface achieves a resistance of 1.38 K/W from junction to coolant at a chip cooling area of 19 mm(exp2), while the ceramic insulation contributes 3 pF to the switch-node. The low parasitic design enables a peak switching speed of 186 V/ns during a hard switched turn-on and 30 V overshoot after soft commutation at full load current.

Original language	English
Title of host publication	PCIM Europe 2021 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
Subtitle of host publication	International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
Publisher	VDE Verlag
Pages	381-387
Number of pages	7
ISBN (Electronic)	9783800755158
ISBN (Print)	978-3-8007-5515-8
Publication status	Published - 2 Jul 2021
Event	2021 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM Europe digital days 2021) - Online Duration: 3 May 2021 → 7 May 2021

Conference

Conference	2021 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM Europe digital days 2021)
Period	3/05/21 → 7/05/21

Access to Document

https://ieeexplore.ieee.org/document/9472272

Cite this

Weiler, B. P., Vermulst, B. J. D., Lemmen, E., & Wijnands, C. G. E. (2021). High Power GaN Module Using 3D-Printed Liquid Coolers for Hard-Switching at Megahertz. In PCIM Europe 2021 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (pp. 381-387). Article 9472272 VDE Verlag. https://ieeexplore.ieee.org/document/9472272

Weiler, B.P. (Pelle) ; Vermulst, Bas J.D. ; Lemmen, Erik et al. / High Power GaN Module Using 3D-Printed Liquid Coolers for Hard-Switching at Megahertz. PCIM Europe 2021 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. VDE Verlag, 2021. pp. 381-387

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title = "High Power GaN Module Using 3D-Printed Liquid Coolers for Hard-Switching at Megahertz",

abstract = "This work presents a power module for high frequency operation, designed to get the maximum performance out of Gallium-Nitride (GaN) devices. The use of metal 3D-printed liquid coolers, ceramic insulation and advanced Indium interface material leads to extremely low thermal resistance and low parasitic impact on switching performance. The presented module consists of four half-bridges, rated for 400 V and output currents of 15 A. The thermal interface achieves a resistance of 1.38 K/W from junction to coolant at a chip cooling area of 19 mm(exp2), while the ceramic insulation contributes 3 pF to the switch-node. The low parasitic design enables a peak switching speed of 186 V/ns during a hard switched turn-on and 30 V overshoot after soft commutation at full load current.",

author = "Weiler, {B.P. (Pelle)} and Vermulst, {Bas J.D.} and Erik Lemmen and Wijnands, {C.G.E. (Korneel)}",

year = "2021",

month = jul,

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isbn = "978-3-8007-5515-8",

pages = "381--387",

booktitle = "PCIM Europe 2021 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management",

publisher = "VDE Verlag",

address = "Germany",

note = "2021 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM Europe digital days 2021) ; Conference date: 03-05-2021 Through 07-05-2021",

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Weiler, BP, Vermulst, BJD , Lemmen, E & Wijnands, CGE 2021, High Power GaN Module Using 3D-Printed Liquid Coolers for Hard-Switching at Megahertz. in PCIM Europe 2021 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management., 9472272, VDE Verlag, pp. 381-387, 2021 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM Europe digital days 2021), 3/05/21. <https://ieeexplore.ieee.org/document/9472272>

High Power GaN Module Using 3D-Printed Liquid Coolers for Hard-Switching at Megahertz. / Weiler, B.P. (Pelle); Vermulst, Bas J.D.; Lemmen, Erik et al.
PCIM Europe 2021 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. VDE Verlag, 2021. p. 381-387 9472272.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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T1 - High Power GaN Module Using 3D-Printed Liquid Coolers for Hard-Switching at Megahertz

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AU - Wijnands, C.G.E. (Korneel)

PY - 2021/7/2

Y1 - 2021/7/2

N2 - This work presents a power module for high frequency operation, designed to get the maximum performance out of Gallium-Nitride (GaN) devices. The use of metal 3D-printed liquid coolers, ceramic insulation and advanced Indium interface material leads to extremely low thermal resistance and low parasitic impact on switching performance. The presented module consists of four half-bridges, rated for 400 V and output currents of 15 A. The thermal interface achieves a resistance of 1.38 K/W from junction to coolant at a chip cooling area of 19 mm(exp2), while the ceramic insulation contributes 3 pF to the switch-node. The low parasitic design enables a peak switching speed of 186 V/ns during a hard switched turn-on and 30 V overshoot after soft commutation at full load current.

AB - This work presents a power module for high frequency operation, designed to get the maximum performance out of Gallium-Nitride (GaN) devices. The use of metal 3D-printed liquid coolers, ceramic insulation and advanced Indium interface material leads to extremely low thermal resistance and low parasitic impact on switching performance. The presented module consists of four half-bridges, rated for 400 V and output currents of 15 A. The thermal interface achieves a resistance of 1.38 K/W from junction to coolant at a chip cooling area of 19 mm(exp2), while the ceramic insulation contributes 3 pF to the switch-node. The low parasitic design enables a peak switching speed of 186 V/ns during a hard switched turn-on and 30 V overshoot after soft commutation at full load current.

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BT - PCIM Europe 2021 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management

PB - VDE Verlag

T2 - 2021 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM Europe digital days 2021)

Y2 - 3 May 2021 through 7 May 2021

ER -

Weiler BP, Vermulst BJD , Lemmen E , Wijnands CGE. High Power GaN Module Using 3D-Printed Liquid Coolers for Hard-Switching at Megahertz. In PCIM Europe 2021 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. VDE Verlag. 2021. p. 381-387. 9472272

High Power GaN Module Using 3D-Printed Liquid Coolers for Hard-Switching at Megahertz

Abstract

Conference

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Next generation of ultrahigh precision power amplifiers for semiconductors lithography

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High Power GaN Module Using 3D-Printed Liquid Coolers for Hard-Switching at Megahertz

Abstract

Conference

Access to Document

Other files and links

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Projects

Next generation of ultrahigh precision power amplifiers for semiconductors lithography

Cite this