High Density Multi-Channel Passively Aligned Optical Probe for Testing of Photonic Integrated Circuits

Xaveer Leijtens (Corresponding author), Rui Santos, Kevin Williams

Research output: Contribution to journalArticleAcademicpeer-review

Abstract

In this work we report the results of high density multi-channel optical multiprobes with pitches of 25 {\mu }\rm{m} and 50 {\mu }\rm{m} that provide edge-coupling used for on-wafer parallel testing of photonic integrated circuits. The probes are fabricated in an oxynitride platform and test demonstrations were carried out of edge-coupled indium-phosphide based photonic integrated circuits (PICs). Thirty-Two optical parallel connections are simultaneously, passively aligned between the probe and the PIC by means of integrated guiding channels. The initial placement tolerance is more than 4 {\mu }\rm{m} to give a passive alignment with an optical power variation of less than 1 dB. Multi-port loop-back optical power measurements are reported and the wavelength-dependent net modal gain of integrated semiconductor optical amplifiers was measured to further validate the concept.

Original languageEnglish
Article number9296295
Number of pages16
JournalIEEE Photonics Journal
Volume13
Issue number1
DOIs
Publication statusPublished - Feb 2021

Keywords

  • fiber-chip coupling
  • optical probing
  • Photonic integrated circuits

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