Heat sinking of highly integrated photonic and electronic circuits

M.B.J. van Rijn; M.K. Smit; Marc Spiegelberg; S. Paredes

Heat sinking of highly integrated photonic and electronic circuits

M.B.J. van Rijn, M.K. Smit, Marc Spiegelberg, S. Paredes

Photonic Integration

Research output: Contribution to conference › Abstract › Academic

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Abstract

Dense integration of photonic and electronic circuits poses high requirements on thermal management. In this paper we present analysis of temperature distributions in PICs in InP membranes on top of a BiCMOS chip, which contain hot spots in both the photonic and the electronic layer (lasers, optical amplifiers, driver electronics).

Original language	English
Publication status	Published - 27 Nov 2017
Event	22nd Annual Symposium of the IEEE Photonics Society Benelux Chapter - Delft, Netherlands Duration: 27 Nov 2017 → 28 Nov 2017 https://www.aanmelder.nl/ipb2017symposium#.Wi6iLnmDO70

Conference

Conference	22nd Annual Symposium of the IEEE Photonics Society Benelux Chapter
Country	Netherlands
City	Delft
Period	27/11/17 → 28/11/17
Internet address	https://www.aanmelder.nl/ipb2017symposium#.Wi6iLnmDO70

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title = "Heat sinking of highly integrated photonic and electronic circuits",

abstract = "Dense integration of photonic and electronic circuits poses high requirements on thermal management. In this paper we present analysis of temperature distributions in PICs in InP membranes on top of a BiCMOS chip, which contain hot spots in both the photonic and the electronic layer (lasers, optical amplifiers, driver electronics). ",

author = "{van Rijn}, M.B.J. and M.K. Smit and Marc Spiegelberg and S. Paredes",

year = "2017",

month = nov,

day = "27",

language = "English",

note = "22nd Annual Symposium of the IEEE Photonics Society Benelux Chapter ; Conference date: 27-11-2017 Through 28-11-2017",

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TY - CONF

T1 - Heat sinking of highly integrated photonic and electronic circuits

AU - van Rijn, M.B.J.

AU - Smit, M.K.

AU - Spiegelberg, Marc

AU - Paredes, S.

PY - 2017/11/27

Y1 - 2017/11/27

N2 - Dense integration of photonic and electronic circuits poses high requirements on thermal management. In this paper we present analysis of temperature distributions in PICs in InP membranes on top of a BiCMOS chip, which contain hot spots in both the photonic and the electronic layer (lasers, optical amplifiers, driver electronics).

AB - Dense integration of photonic and electronic circuits poses high requirements on thermal management. In this paper we present analysis of temperature distributions in PICs in InP membranes on top of a BiCMOS chip, which contain hot spots in both the photonic and the electronic layer (lasers, optical amplifiers, driver electronics).

M3 - Abstract

T2 - 22nd Annual Symposium of the IEEE Photonics Society Benelux Chapter

Y2 - 27 November 2017 through 28 November 2017

ER -