Heat sinking of highly integrated photonic and electronic circuits

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Abstract

Dense integration of photonic and electronic circuits poses high requirements on thermal management. In this paper we present analysis of temperature distributions in PICs in InP membranes on top of a BiCMOS chip, which contain hot spots in both the photonic and the electronic layer (lasers, optical amplifiers, driver electronics).
Original languageEnglish
Publication statusPublished - 27 Nov 2017
Event22nd Annual Symposium of the IEEE Photonics Society Benelux Chapter - Delft, Netherlands
Duration: 27 Nov 201728 Nov 2017
https://www.aanmelder.nl/ipb2017symposium#.Wi6iLnmDO70

Conference

Conference22nd Annual Symposium of the IEEE Photonics Society Benelux Chapter
CountryNetherlands
CityDelft
Period27/11/1728/11/17
Internet address

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