Dense integration of photonic and electronic circuits poses high requirements on thermal management. In this paper we present analysis of temperature distributions in PICs in InP membranes on top of a BiCMOS chip, which contain hot spots in both the photonic and the electronic layer (lasers, optical amplifiers, driver electronics).
|Publication status||Published - 27 Nov 2017|
|Event||22nd Annual Symposium of the IEEE Photonics Society Benelux - Delft, Netherlands|
Duration: 27 Nov 2017 → 28 Nov 2017
Conference number: 22
|Conference||22nd Annual Symposium of the IEEE Photonics Society Benelux|
|Period||27/11/17 → 28/11/17|