Heat-resistant polyimides

C.E. Koning; L.M.J. Teuwen; E.W. Meijer

Heat-resistant polyimides

C.E. Koning (Inventor), L.M.J. Teuwen (Inventor), E.W. Meijer (Inventor)

Research output: Patent › Patent publication

Abstract

The title polyimides are prepd. from 3,3',4,4'-benzophenone dianhydride and primary aliph. diamines contg. substantially 1,4-diaminobutane.

Original language	English
Patent number	EP522649 A1
Publication status	Published - 13 Jan 1993

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title = "Heat-resistant polyimides",

abstract = "The title polyimides are prepd. from 3,3',4,4'-benzophenone dianhydride and primary aliph. diamines contg. substantially 1,4-diaminobutane.",

author = "C.E. Koning and L.M.J. Teuwen and E.W. Meijer",

year = "1993",

month = jan,

day = "13",

language = "English",

type = "Patent",

note = "EP522649 A1",

}

TY - PAT

T1 - Heat-resistant polyimides

AU - Koning, C.E.

AU - Teuwen, L.M.J.

AU - Meijer, E.W.

PY - 1993/1/13

Y1 - 1993/1/13

N2 - The title polyimides are prepd. from 3,3',4,4'-benzophenone dianhydride and primary aliph. diamines contg. substantially 1,4-diaminobutane.

AB - The title polyimides are prepd. from 3,3',4,4'-benzophenone dianhydride and primary aliph. diamines contg. substantially 1,4-diaminobutane.

UR - http://preview.espacenet.com/textdoc?DB=EPODOC&IDX=EP0522649&F=0

M3 - Patent publication

M1 - EP522649 A1

ER -

Heat-resistant polyimides

Abstract

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