TY - JOUR
T1 - Guest editorial antenna-in-package, antenna-on-chip, antenna-IC interface
T2 - joint design and cointegration
AU - Hong, Wonbin
AU - Maaskant, Rob
AU - Liu, Duixian
AU - Wang, Hua
AU - Shamim, Atif
AU - Smolders, Bart
AU - Manteuffel, Dirk
AU - Zhang, Yueping
PY - 2019/11
Y1 - 2019/11
N2 - The twenty peer-reviewed letters in this special section examine the design and cointegration of antenna-in-package (AiP), antenna-on-chip (AoC), and antenna ICs (AIC). The letters are categorized in the four distinctive categories: 1) Fabrication technologies (four); 2) Measurement strategies; 3) Applications; and 4) New design and integration strategies. Fruition of major thrusts such as 5G/6G, high-resolution radar and imaging, autonomous driving, and space technology are highly intertwined with the advance of applied electromagnetics. Miniaturization and seamless integration of microwave components and radio systems can enable superior performance, form factor, and cost efficiencies leading to enhanced proliferation of such applications. Historically, radio frequency front ends, antennas, and microwave components have separately evolved using distinct fabrication and measurement technologies.
AB - The twenty peer-reviewed letters in this special section examine the design and cointegration of antenna-in-package (AiP), antenna-on-chip (AoC), and antenna ICs (AIC). The letters are categorized in the four distinctive categories: 1) Fabrication technologies (four); 2) Measurement strategies; 3) Applications; and 4) New design and integration strategies. Fruition of major thrusts such as 5G/6G, high-resolution radar and imaging, autonomous driving, and space technology are highly intertwined with the advance of applied electromagnetics. Miniaturization and seamless integration of microwave components and radio systems can enable superior performance, form factor, and cost efficiencies leading to enhanced proliferation of such applications. Historically, radio frequency front ends, antennas, and microwave components have separately evolved using distinct fabrication and measurement technologies.
UR - http://www.scopus.com/inward/record.url?scp=85075023300&partnerID=8YFLogxK
U2 - 10.1109/LAWP.2019.2945829
DO - 10.1109/LAWP.2019.2945829
M3 - Editorial
SN - 1536-1225
VL - 18
SP - 2345
EP - 2350
JO - IEEE Antennas and Wireless Propagation Letters
JF - IEEE Antennas and Wireless Propagation Letters
IS - 11
M1 - 8891841
ER -