TY - JOUR
T1 - Growth kinetics of the intermetallic phase in diffusion-soldered (Cu-5 at.%Ni)/Sn/(Cu-5 at.%Ni) interconnections
AU - Wierzbicka-Miernik, A.
AU - Miernik, K.
AU - Wojewoda-Budka, J.
AU - Szyszkiewicz, K.
AU - Filipek, R.
AU - Litynska-Dobrzynska, L.
AU - Kodentsov, A.
AU - Zieba, P.
PY - 2013
Y1 - 2013
N2 - A stereological analysis was carried out in order to obtain the kinetics parameters of the (Cu1-xNix)6Sn5 growth in the diffusion soldered (Cu–5 at.%Ni)/Sn/(Cu–5 at.%Ni) interconnections where previously anomalous fast growth of this phase was described. The n-parameter in the equation x = ktn was found to be 0.27–0.15 in the temperature range 240–260 °C, respectively. This is far away from the volume control process (n = 1 if total surface of forming phase is the reference). The TEM/EDX microanalysis made across the (Cu1-xNix)6Sn5/Sn – solder showed sudden change of Sn and Cu content typical for the grain boundary diffusion as the rate controlling mechanism.
AB - A stereological analysis was carried out in order to obtain the kinetics parameters of the (Cu1-xNix)6Sn5 growth in the diffusion soldered (Cu–5 at.%Ni)/Sn/(Cu–5 at.%Ni) interconnections where previously anomalous fast growth of this phase was described. The n-parameter in the equation x = ktn was found to be 0.27–0.15 in the temperature range 240–260 °C, respectively. This is far away from the volume control process (n = 1 if total surface of forming phase is the reference). The TEM/EDX microanalysis made across the (Cu1-xNix)6Sn5/Sn – solder showed sudden change of Sn and Cu content typical for the grain boundary diffusion as the rate controlling mechanism.
U2 - 10.1016/j.matchemphys.2013.08.022
DO - 10.1016/j.matchemphys.2013.08.022
M3 - Article
SN - 0254-0584
VL - 142
SP - 682
EP - 685
JO - Materials Chemistry and Physics
JF - Materials Chemistry and Physics
IS - 2-3
ER -