Generic process for low-cost InP integrated photonics in industrial foundries

L.M. Augustin, H.P.M.M. Ambrosius, P.J.A. Thijs, F.M. Soares, N. Grote, R. Szymanski, M.J. Wale, M.K. Smit

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Abstract

Application Specific Photonic Integrated Circuits (ASPICs) are considered key elements to make photonic systems or subsystems cheap and ubiquitous. ASPICs still are several orders of magnitude more expensive than their microelectronic counterpart: ASICS, which has restricted their application to a few niche markets. A novel approach in photonic integration is emerging that will reduce the R&D costs of ASPICs by more than an order of magnitude. It will bring the application of ASPICs that integrate complex and advanced photonic functionality on a single chip within reach for a large number of small and larger companies and initiate a breakthrough in the application of Photonic ICs. In this paper the process is explained. A significant number of designs has been realized the last 4 years, for a variety of applications in telecoms, datacoms, medical and sensing, from parties all over the world.
Original languageEnglish
Title of host publicationIntegrated Photonics : Materials Devices, and Applications II, 24-28 April 2013, Grenoble, France
EditorsJ.M. Fédéli, L. Vivien, M.K. Smit
Place of PublicationBellingham
PublisherSPIE
Pages87670F-1/7
ISBN (Print)9780819495648
DOIs
Publication statusPublished - 2013
EventIntegrated Photonics: Materials Devices, and Applications II, April 24-28, 2013, Grenoble, France - Grenoble, France
Duration: 24 Apr 201328 Apr 2013

Publication series

NameProceedings of SPIE
Volume8767
ISSN (Print)0277-786X

Conference

ConferenceIntegrated Photonics: Materials Devices, and Applications II, April 24-28, 2013, Grenoble, France
CountryFrance
CityGrenoble
Period24/04/1328/04/13

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