Abstract
We show that poly-SiGe can be readily integrated as a gate material into an existing CMOS technology to achieve significant increase in the transistor performance. In order to preserve the standard salicidation scheme, a buffer poly-Si layer is introduced in the gate stack. PMOST channel profiles are optimized to account for the change of the gate workfunction. High-performance CMOS 0.18 μm devices are manufactured using p- and n-type poly-Si/Si0.8Ge0.2 gates.
Original language | English |
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Title of host publication | 1997 International Electron Devices Meeting |
Place of Publication | Piscataway |
Publisher | Institute of Electrical and Electronics Engineers |
Pages | 829-832 |
Number of pages | 4 |
ISBN (Print) | 0-7803-4100-7 |
DOIs | |
Publication status | Published - 1 Dec 1997 |
Externally published | Yes |
Event | 1997 IEEE International Electron Devices Meeting, IEDM 1997 - Washington, United States Duration: 7 Dec 1997 → 10 Dec 1997 |
Conference
Conference | 1997 IEEE International Electron Devices Meeting, IEDM 1997 |
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Abbreviated title | IEDM 1997 |
Country/Territory | United States |
City | Washington |
Period | 7/12/97 → 10/12/97 |