Abstract
The title compds., which do not impair the adhesion or cohesion of binders for inorg. matrixes with which they are used, contain contain >=4 siloxy groups of specified compn. Stirring 2.5 mol iso-BuSi(OMe)3 with 0.11 mol KOH in aq. acetone at 30 Deg for 3 days gave 96% iso-Bu8Si8O12; reaction of which (63 mmol) with 278 mmol H2O and 437 mmol LiOH in acetone-MeOH at 55 Deg for 18 h gave 96% iso-Bu7Si7O9(OH)3; reaction of which (12.6 mmol) with 40 mmol ClMe2Si(CH2)3NCO in THF-Et3N at 20 Deg gave 89% iso-Bu7Si7O9[OSiMe2(CH2)3NCO]3. Use of the products in hot-melt adhesives is exemplified. [on SciFinder (R)]
| Original language | English |
|---|---|
| Publication status | Published - 20 Nov 2003 |
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