Fully assembled 120Gb/s transceiver chips for high bandwidth density optical interconnects

P. Duan, O. Raz, Barry E. Smalbrugge, J. Duis, H.J.S. Dorren

Research output: Contribution to conferencePoster

Abstract

A complete 12X10Gb/s optical interconnect link, consisting of a novel fully assembled 12X10Gb/s transmitter chip and a fully assembled 12X10Gb/s receiver chip, will be shown in the paper. This new assembled approach utilized a thick photoresist ramp between CMOS driver and opto-electrical dies as the bridge for supporting co-plannar waveguides electrically plated with lithographic accuracy, which will allow for impedance matched metallic wiring between the electronic driving circuit and its optoelectronic counter part. The work is aiming to provide a quasi-wafer scale process for high bandwidth density, compact footprint and potentially low cost transceivers for future high-performance computing systems.
Original languageEnglish
Pages155-158
Publication statusPublished - 2012

Bibliographical note

Proceedings of the 17th Annual Symposium of the IEEE Photonics Society Benelux Chapter, 29-30 Novembre 2012, Mons, Belgium

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