Fracture and delamination in microelectronics

L.J. Ernst, W.D. van Driel, O. Sluis, van der, A. Corigliano, A.A.O. Tay, N. Iwamoto, M.M.F. Yuen

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review


This paper gives an overview of the various methods commonly used in the design process ofmicroelectronic packages to minimize the occurrence of failure originating from interface fracture. The methods being discussed range from interface fracture mechanics, till molecular modeling. Purely fracture mechanics approaches require presumptions about the presence of initial delamination, which generally are unknown in the design process, whereas other methods just test the sensitivity of the design on the occurrence of possible delamination. More basic understanding about the interface strength is obtained through various molecular modeling approaches. Thevarious methods being discussed are illustrated with sample problems at various scales withinmicroelectronics packaging. Also various test methods to attain interface material properties are discussed.
Original languageEnglish
Title of host publicationAsian Pacific Conference for Fracture and Strength (APCFS06)
Place of PublicationChina, Sanya, Hainan Island
Publication statusPublished - 2006


Dive into the research topics of 'Fracture and delamination in microelectronics'. Together they form a unique fingerprint.

Cite this