This paper gives an overview of the various methods commonly used in the design process ofmicroelectronic packages to minimize the occurrence of failure originating from interface fracture. The methods being discussed range from interface fracture mechanics, till molecular modeling. Purely fracture mechanics approaches require presumptions about the presence of initial delamination, which generally are unknown in the design process, whereas other methods just test the sensitivity of the design on the occurrence of possible delamination. More basic understanding about the interface strength is obtained through various molecular modeling approaches. Thevarious methods being discussed are illustrated with sample problems at various scales withinmicroelectronics packaging. Also various test methods to attain interface material properties are discussed.
|Title of host publication||Asian Pacific Conference for Fracture and Strength (APCFS06)|
|Place of Publication||China, Sanya, Hainan Island|
|Publication status||Published - 2006|