Fracture and delamination in microelectronic devices

L.J. Ernst; W.D. van Driel; O. Sluis, van der; A. Corigliano; A.A.O. Tay; N. Iwamoto; M.M.F. Yuen

Fracture and delamination in microelectronic devices

L.J. Ernst
, W.D. van Driel
, O. Sluis, van der
, A. Corigliano
, A.A.O. Tay
, N. Iwamoto
, M.M.F. Yuen

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Academic

Original language	English
Title of host publication	Smart Systems Integration and Reliability
Subtitle of host publication	honorary volume on the occasion of Herbert Reichel’s 65th birthday
Editors	B. Michel, K.-D. Lang
Place of Publication	Dresden
Publisher	Goldenbogen Verlag
Pages	634-663
ISBN (Print)	978-3-932434-77-8
Publication status	Published - 2010

Cite this

@inbook{48a9a53d45724aca96bfb27b49b83ea8,

title = "Fracture and delamination in microelectronic devices",

author = "L.J. Ernst and \{van Driel\}, W.D. and \{Sluis, van der\}, O. and A. Corigliano and A.A.O. Tay and N. Iwamoto and M.M.F. Yuen",

year = "2010",

language = "English",

isbn = "978-3-932434-77-8",

pages = "634--663",

editor = "B. Michel and K.-D. Lang",

booktitle = "Smart Systems Integration and Reliability",

publisher = "Goldenbogen Verlag",

}

Fracture and delamination in microelectronic devices. / Ernst, L.J.; van Driel, W.D.; Sluis, van der, O. et al.
Smart Systems Integration and Reliability: honorary volume on the occasion of Herbert Reichel’s 65th birthday. ed. / B. Michel; K.-D. Lang. Dresden: Goldenbogen Verlag, 2010. p. 634-663.

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Academic

TY - CHAP

T1 - Fracture and delamination in microelectronic devices

AU - Ernst, L.J.

AU - van Driel, W.D.

AU - Sluis, van der, O.

AU - Corigliano, A.

AU - Tay, A.A.O.

AU - Iwamoto, N.

AU - Yuen, M.M.F.

PY - 2010

Y1 - 2010

M3 - Chapter

SN - 978-3-932434-77-8

SP - 634

EP - 663

BT - Smart Systems Integration and Reliability

A2 - Michel, B.

A2 - Lang, K.-D.

PB - Goldenbogen Verlag

CY - Dresden

ER -