Fracture and delamination in microelectronic devices

L.J. Ernst, W.D. van Driel, O. Sluis, van der, A. Corigliano, A.A.O. Tay, N. Iwamoto, M.M.F. Yuen

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Academic

Original language	English
Title of host publication	Smart Systems Integration and Reliability (honorary volume on the occasion of Herbert Reichel’s 65th birthday)
Place of Publication	Dresden, Germany
Publisher	Goldenbogen Verlag
Pages	634-663
ISBN (Print)	978-3-932434-77-8
Publication status	Published - 2010

Cite this

@inbook{48a9a53d45724aca96bfb27b49b83ea8,

title = "Fracture and delamination in microelectronic devices",

author = "L.J. Ernst and {van Driel}, W.D. and {Sluis, van der}, O. and A. Corigliano and A.A.O. Tay and N. Iwamoto and M.M.F. Yuen",

year = "2010",

language = "English",

isbn = "978-3-932434-77-8",

pages = "634--663",

booktitle = "Smart Systems Integration and Reliability (honorary volume on the occasion of Herbert Reichel{\textquoteright}s 65th birthday)",

publisher = "Goldenbogen Verlag",

}

TY - CHAP

T1 - Fracture and delamination in microelectronic devices

AU - Ernst, L.J.

AU - van Driel, W.D.

AU - Sluis, van der, O.

AU - Corigliano, A.

AU - Tay, A.A.O.

AU - Iwamoto, N.

AU - Yuen, M.M.F.

PY - 2010

Y1 - 2010

M3 - Chapter

SN - 978-3-932434-77-8

SP - 634

EP - 663

BT - Smart Systems Integration and Reliability (honorary volume on the occasion of Herbert Reichel’s 65th birthday)

PB - Goldenbogen Verlag

CY - Dresden, Germany

ER -