Abstract
Photonic Integration is required to achieve cost, performance and scalability targets for data- and telecom. InP is the material of choice for full monolithic integration of lasers, amplifiers as well as modulators and passive circuitry. Progress in the technology opens the route to volume manufacturing.
| Original language | English |
|---|---|
| Title of host publication | 31st Annual Conference of the IEEE Photonics Society, IPC 2018 |
| Place of Publication | Piscataway |
| Publisher | Institute of Electrical and Electronics Engineers |
| Number of pages | 1 |
| ISBN (Electronic) | 978-1-5386-5358-6 |
| DOIs | |
| Publication status | Published - 6 Nov 2018 |
| Externally published | Yes |
| Event | 31st IEEE Photonics Conference, IPC 2018 - Reston, United States Duration: 30 Sept 2018 → 4 Oct 2018 Conference number: 31 https://ieee-ipc.org/ https://www.conferenceabstracts.com/cfp2/login.asp?EventKey=DSUSJYRO |
Conference
| Conference | 31st IEEE Photonics Conference, IPC 2018 |
|---|---|
| Abbreviated title | IPC 2018 |
| Country/Territory | United States |
| City | Reston |
| Period | 30/09/18 → 4/10/18 |
| Internet address |
Keywords
- III-V semiconductor materials
- Microwave photonics
- Photodiodes
- Photonic integrated circuits
- Quantum well lasers
- Semiconductor optical amplifiers
- Silicon Photonics
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