Flip-Chip Integration

Yikun Yu; Peter G.M. Baltus; Arthur H.M. van Roermund

doi:10.1007/978-94-007-0662-0_8

Flip-Chip Integration

Yikun Yu, Peter G.M. Baltus, Arthur H.M. van Roermund

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Academic › peer-review

2 Citations (Scopus)

Abstract

This chapter presents the integration of a 60GHz amplifier and an antenna in a printed circuit-board (PCB) technology. The materials that are used for the realization of the PCB package are discussed. The implementation of flip-chip interconnection between the amplifier and the PCB is presented. The measurement results of the flip-chip integration are presented and discussed.

Original language	English
Title of host publication	Integrated 60GHz RF Beamforming in CMOS
Place of Publication	Dordrecht
Publisher	Springer
Chapter	8
Pages	93-103
Number of pages	11
ISBN (Electronic)	978-94-007-0662-0
ISBN (Print)	978-94-007-0661-3, 978-94-007-3493-7
DOIs	https://doi.org/10.1007/978-94-007-0662-0_8
Publication status	Published - 2011

Publication series

Name	Analog Circuits and Signal Processing
Volume	1
ISSN (Print)	1872-082X
ISSN (Electronic)	2197-1854

Keywords

Anisotropic Conductive Adhesive
Gold Bump
Large Thermal Expansion
Package Prototype
Radiation Pattern

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10.1007/978-94-007-0662-0_8

Cite this

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title = "Flip-Chip Integration",

abstract = "This chapter presents the integration of a 60GHz amplifier and an antenna in a printed circuit-board (PCB) technology. The materials that are used for the realization of the PCB package are discussed. The implementation of flip-chip interconnection between the amplifier and the PCB is presented. The measurement results of the flip-chip integration are presented and discussed.",

keywords = "Anisotropic Conductive Adhesive, Gold Bump, Large Thermal Expansion, Package Prototype, Radiation Pattern",

author = "Yikun Yu and Baltus, \{Peter G.M.\} and \{van Roermund\}, \{Arthur H.M.\}",

year = "2011",

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AU - Baltus, Peter G.M.

AU - van Roermund, Arthur H.M.

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AB - This chapter presents the integration of a 60GHz amplifier and an antenna in a printed circuit-board (PCB) technology. The materials that are used for the realization of the PCB package are discussed. The implementation of flip-chip interconnection between the amplifier and the PCB is presented. The measurement results of the flip-chip integration are presented and discussed.

KW - Anisotropic Conductive Adhesive

KW - Gold Bump

KW - Large Thermal Expansion

KW - Package Prototype

KW - Radiation Pattern

UR - https://www.scopus.com/pages/publications/85145665722

U2 - 10.1007/978-94-007-0662-0_8

DO - 10.1007/978-94-007-0662-0_8

M3 - Chapter

AN - SCOPUS:85145665722

SN - 978-94-007-0661-3

SN - 978-94-007-3493-7

T3 - Analog Circuits and Signal Processing

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BT - Integrated 60GHz RF Beamforming in CMOS

PB - Springer

CY - Dordrecht

ER -

Flip-Chip Integration

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