Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band

J.A.G. Akkermans; M.I. Kazim; Y. Yu; M.H.A.J. Herben; P.G.M. Baltus; P.F.M. Smulders

Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band

J.A.G. Akkermans
, M.I. Kazim
, Y. Yu
, M.H.A.J. Herben
, P.G.M. Baltus
, P.F.M. Smulders

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

10 Citations (Scopus)

166 Downloads (Pure)

Abstract

The integration of a CMOS power amplifier (PA) and antenna in printed circuit-board (PCB) technology is investigated. Both the PA and the antenna have a differential design to provide a reliable low-loss interconnect. A PCB package is proposed that enables the implementation of a high-efficiency antenna while providing mechanical rigidity. The interconnection between the PA and the antenna is realised with flip-chip technology. The performance of the package is demonstrated with measurements of the realised antenna gain and radiation patterns.

Original language	English
Title of host publication	3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	2818-2822
ISBN (Print)	978-1-4244-4753-4
Publication status	Published - 2009

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Akkermans, J. A. G., Kazim, M. I., Yu, Y., Herben, M. H. A. J., Baltus, P. G. M., & Smulders, P. F. M. (2009). Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band. In 3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany (pp. 2818-2822). Institute of Electrical and Electronics Engineers.

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title = "Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band",

abstract = "The integration of a CMOS power amplifier (PA) and antenna in printed circuit-board (PCB) technology is investigated. Both the PA and the antenna have a differential design to provide a reliable low-loss interconnect. A PCB package is proposed that enables the implementation of a high-efficiency antenna while providing mechanical rigidity. The interconnection between the PA and the antenna is realised with flip-chip technology. The performance of the package is demonstrated with measurements of the realised antenna gain and radiation patterns.",

author = "J.A.G. Akkermans and M.I. Kazim and Y. Yu and M.H.A.J. Herben and P.G.M. Baltus and P.F.M. Smulders",

year = "2009",

language = "English",

isbn = "978-1-4244-4753-4",

pages = "2818--2822",

booktitle = "3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

}

Akkermans, JAG, Kazim, MI, Yu, Y, Herben, MHAJ , Baltus, PGM & Smulders, PFM 2009, Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band. in 3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany. Institute of Electrical and Electronics Engineers, Piscataway, pp. 2818-2822.

Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band. / Akkermans, J.A.G.; Kazim, M.I.; Yu, Y. et al.
3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany. Piscataway: Institute of Electrical and Electronics Engineers, 2009. p. 2818-2822.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band

AU - Akkermans, J.A.G.

AU - Kazim, M.I.

AU - Yu, Y.

AU - Herben, M.H.A.J.

AU - Baltus, P.G.M.

AU - Smulders, P.F.M.

PY - 2009

Y1 - 2009

N2 - The integration of a CMOS power amplifier (PA) and antenna in printed circuit-board (PCB) technology is investigated. Both the PA and the antenna have a differential design to provide a reliable low-loss interconnect. A PCB package is proposed that enables the implementation of a high-efficiency antenna while providing mechanical rigidity. The interconnection between the PA and the antenna is realised with flip-chip technology. The performance of the package is demonstrated with measurements of the realised antenna gain and radiation patterns.

AB - The integration of a CMOS power amplifier (PA) and antenna in printed circuit-board (PCB) technology is investigated. Both the PA and the antenna have a differential design to provide a reliable low-loss interconnect. A PCB package is proposed that enables the implementation of a high-efficiency antenna while providing mechanical rigidity. The interconnection between the PA and the antenna is realised with flip-chip technology. The performance of the package is demonstrated with measurements of the realised antenna gain and radiation patterns.

M3 - Conference contribution

SN - 978-1-4244-4753-4

SP - 2818

EP - 2822

BT - 3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

ER -

Akkermans JAG, Kazim MI, Yu Y, Herben MHAJ , Baltus PGM, Smulders PFM. Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band. In 3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany. Piscataway: Institute of Electrical and Electronics Engineers. 2009. p. 2818-2822

Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band

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