The integration of a CMOS power amplifier (PA) and antenna in printed circuit-board (PCB) technology is investigated. Both the PA and the antenna have a differential design to provide a reliable low-loss interconnect. A PCB package is proposed that enables the implementation of a high-efficiency antenna while providing mechanical rigidity. The interconnection between the PA and the antenna is realised with flip-chip technology. The performance of the package is demonstrated with measurements of the realised antenna gain and radiation patterns.
|Title of host publication||3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany|
|Place of Publication||Piscataway|
|Publisher||Institute of Electrical and Electronics Engineers|
|Publication status||Published - 2009|
Akkermans, J. A. G., Kazim, M. I., Yu, Y., Herben, M. H. A. J., Baltus, P. G. M., & Smulders, P. F. M. (2009). Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band. In 3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany (pp. 2818-2822). Piscataway: Institute of Electrical and Electronics Engineers.