Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band

J.A.G. Akkermans, M.I. Kazim, Y. Yu, M.H.A.J. Herben, P.G.M. Baltus, P.F.M. Smulders

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

8 Citations (Scopus)
57 Downloads (Pure)

Abstract

The integration of a CMOS power amplifier (PA) and antenna in printed circuit-board (PCB) technology is investigated. Both the PA and the antenna have a differential design to provide a reliable low-loss interconnect. A PCB package is proposed that enables the implementation of a high-efficiency antenna while providing mechanical rigidity. The interconnection between the PA and the antenna is realised with flip-chip technology. The performance of the package is demonstrated with measurements of the realised antenna gain and radiation patterns.
Original languageEnglish
Title of host publication3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages2818-2822
ISBN (Print)978-1-4244-4753-4
Publication statusPublished - 2009

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    Akkermans, J. A. G., Kazim, M. I., Yu, Y., Herben, M. H. A. J., Baltus, P. G. M., & Smulders, P. F. M. (2009). Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band. In 3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany (pp. 2818-2822). Piscataway: Institute of Electrical and Electronics Engineers.