Flip-chip III-V-to-silicon photonics interfaces for optical sensor

Yves Martin; Jason S. Orcutt; Chi Xiong; Laurent Schares; Tymon Barwicz; Martin Glodde; Swetha Kamlapurkar; Eric J. Zhang; William M.J. Green; Victor Dolores Calzadilla; Ariane Sigmund; Martin Moehrle

doi:10.1109/ECTC.2019.00166

Flip-chip III-V-to-silicon photonics interfaces for optical sensor

Yves Martin, Jason S. Orcutt, Chi Xiong, Laurent Schares, Tymon Barwicz, Martin Glodde, Swetha Kamlapurkar, Eric J. Zhang, William M.J. Green, Victor Dolores Calzadilla, Ariane Sigmund, Martin Moehrle

Photonic Integration

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

6 Citations (Scopus)

3 Downloads (Pure)

Abstract

We demonstrate flip-chip solder assembly of InP chips on Silicon-Photonic (Si-Ph) substrates aimed at high volume manufacturing using typical microelectronic lead-free solders. In our show-case application, an InP die is both a light source and a detector in an integrated optical methane gas sensor that operates near 1.6mm. For high-resolution laser absorption spectroscopy sensing, a single-mode tunable laser is desired. We create an external cavity laser with InP as optical gain, butt-coupled to a Si-Ph external cavity, which incorporates the laser's frequency selective elements. For minimal reflection at the InP-Si interface, waveguides are angled to the facet, an index-matching medium is applied between the mating surfaces, and an anti-reflection coating designed for the index-matching medium is applied to the optical coupling facet of InP chip. Sub-micron alignment accuracy is obtained without high-accuracy assembly tooling. Lithographically defined alignment features on both InP and Si components allow reproducible high-accuracy alignment. Interface throughput loss were measured to be as low as 1.4 dB, and interface reflections are more than 30dB smaller than main signal beams.

Original language	English
Title of host publication	Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	1060-1066
Number of pages	7
ISBN (Electronic)	978-1-7281-1499-6
DOIs	https://doi.org/10.1109/ECTC.2019.00166
Publication status	Published - 1 May 2019
Event	69th IEEE Electronic Components and Technology Conference, ECTC 2019 - Las Vegas, United States Duration: 28 May 2019 → 31 May 2019

Conference

Conference	69th IEEE Electronic Components and Technology Conference, ECTC 2019
Country/Territory	United States
City	Las Vegas
Period	28/05/19 → 31/05/19

Funding

The information, data, or work presented herein was funded in part by the Advanced Research Projects Agency-Energy (ARPA-E), U.S. Department of Energy, under Award Number DE-AR0000540. The views and opinions of authors expressed herein do not necessarily state or reflect those of the United States Government or any agency thereof. The authors would like to thank the staff at the IBM Microelectronics Research Laboratory and Central Scientific Services for their assistance in the fabrication of the Si-Ph components, as well as Theodore van Kessel, Levente Klein, Ramachandran Muralidhar, and Hendrik Hamann (all of IBM Research) for many discussions.

Keywords

Flip-chip assembly
Heterogeneous assembly
Silicon & III-V photonics
Solder reflow
flip-chip assembly
solder reflow
heterogeneous assembly

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10.1109/ECTC.2019.00166

Cite this

Martin, Y., Orcutt, J. S., Xiong, C., Schares, L., Barwicz, T., Glodde, M., Kamlapurkar, S., Zhang, E. J., Green, W. M. J., Dolores Calzadilla, V., Sigmund, A., & Moehrle, M. (2019). Flip-chip III-V-to-silicon photonics interfaces for optical sensor. In Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019 (pp. 1060-1066). Article 8811247 Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ECTC.2019.00166

@inproceedings{e5a6dfbfb7fc4a75a3e499ea54ba5d7c,

title = "Flip-chip III-V-to-silicon photonics interfaces for optical sensor",

abstract = "We demonstrate flip-chip solder assembly of InP chips on Silicon-Photonic (Si-Ph) substrates aimed at high volume manufacturing using typical microelectronic lead-free solders. In our show-case application, an InP die is both a light source and a detector in an integrated optical methane gas sensor that operates near 1.6mm. For high-resolution laser absorption spectroscopy sensing, a single-mode tunable laser is desired. We create an external cavity laser with InP as optical gain, butt-coupled to a Si-Ph external cavity, which incorporates the laser's frequency selective elements. For minimal reflection at the InP-Si interface, waveguides are angled to the facet, an index-matching medium is applied between the mating surfaces, and an anti-reflection coating designed for the index-matching medium is applied to the optical coupling facet of InP chip. Sub-micron alignment accuracy is obtained without high-accuracy assembly tooling. Lithographically defined alignment features on both InP and Si components allow reproducible high-accuracy alignment. Interface throughput loss were measured to be as low as 1.4 dB, and interface reflections are more than 30dB smaller than main signal beams.",

keywords = "Flip-chip assembly, Heterogeneous assembly, Silicon & III-V photonics, Solder reflow, flip-chip assembly, solder reflow, heterogeneous assembly",

author = "Yves Martin and Orcutt, {Jason S.} and Chi Xiong and Laurent Schares and Tymon Barwicz and Martin Glodde and Swetha Kamlapurkar and Zhang, {Eric J.} and Green, {William M.J.} and {Dolores Calzadilla}, Victor and Ariane Sigmund and Martin Moehrle",

year = "2019",

month = may,

day = "1",

doi = "10.1109/ECTC.2019.00166",

language = "English",

pages = "1060--1066",

booktitle = "Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "69th IEEE Electronic Components and Technology Conference, ECTC 2019 ; Conference date: 28-05-2019 Through 31-05-2019",

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Martin, Y, Orcutt, JS, Xiong, C, Schares, L, Barwicz, T, Glodde, M, Kamlapurkar, S, Zhang, EJ, Green, WMJ, Dolores Calzadilla, V, Sigmund, A & Moehrle, M 2019, Flip-chip III-V-to-silicon photonics interfaces for optical sensor. in Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019., 8811247, Institute of Electrical and Electronics Engineers, Piscataway, pp. 1060-1066, 69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, United States, 28/05/19. https://doi.org/10.1109/ECTC.2019.00166

Flip-chip III-V-to-silicon photonics interfaces for optical sensor. / Martin, Yves; Orcutt, Jason S.; Xiong, Chi et al.
Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Piscataway: Institute of Electrical and Electronics Engineers, 2019. p. 1060-1066 8811247.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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AU - Martin, Yves

AU - Orcutt, Jason S.

AU - Xiong, Chi

AU - Schares, Laurent

AU - Barwicz, Tymon

AU - Glodde, Martin

AU - Kamlapurkar, Swetha

AU - Zhang, Eric J.

AU - Green, William M.J.

AU - Dolores Calzadilla, Victor

AU - Sigmund, Ariane

AU - Moehrle, Martin

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N2 - We demonstrate flip-chip solder assembly of InP chips on Silicon-Photonic (Si-Ph) substrates aimed at high volume manufacturing using typical microelectronic lead-free solders. In our show-case application, an InP die is both a light source and a detector in an integrated optical methane gas sensor that operates near 1.6mm. For high-resolution laser absorption spectroscopy sensing, a single-mode tunable laser is desired. We create an external cavity laser with InP as optical gain, butt-coupled to a Si-Ph external cavity, which incorporates the laser's frequency selective elements. For minimal reflection at the InP-Si interface, waveguides are angled to the facet, an index-matching medium is applied between the mating surfaces, and an anti-reflection coating designed for the index-matching medium is applied to the optical coupling facet of InP chip. Sub-micron alignment accuracy is obtained without high-accuracy assembly tooling. Lithographically defined alignment features on both InP and Si components allow reproducible high-accuracy alignment. Interface throughput loss were measured to be as low as 1.4 dB, and interface reflections are more than 30dB smaller than main signal beams.

AB - We demonstrate flip-chip solder assembly of InP chips on Silicon-Photonic (Si-Ph) substrates aimed at high volume manufacturing using typical microelectronic lead-free solders. In our show-case application, an InP die is both a light source and a detector in an integrated optical methane gas sensor that operates near 1.6mm. For high-resolution laser absorption spectroscopy sensing, a single-mode tunable laser is desired. We create an external cavity laser with InP as optical gain, butt-coupled to a Si-Ph external cavity, which incorporates the laser's frequency selective elements. For minimal reflection at the InP-Si interface, waveguides are angled to the facet, an index-matching medium is applied between the mating surfaces, and an anti-reflection coating designed for the index-matching medium is applied to the optical coupling facet of InP chip. Sub-micron alignment accuracy is obtained without high-accuracy assembly tooling. Lithographically defined alignment features on both InP and Si components allow reproducible high-accuracy alignment. Interface throughput loss were measured to be as low as 1.4 dB, and interface reflections are more than 30dB smaller than main signal beams.

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KW - Heterogeneous assembly

KW - Silicon & III-V photonics

KW - Solder reflow

KW - flip-chip assembly

KW - solder reflow

KW - heterogeneous assembly

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BT - Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019

PB - Institute of Electrical and Electronics Engineers

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Y2 - 28 May 2019 through 31 May 2019

ER -

Flip-chip III-V-to-silicon photonics interfaces for optical sensor

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Keywords

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