Flip-chip III-V-to-silicon photonics interfaces for optical sensor

Yves Martin, Jason S. Orcutt, Chi Xiong, Laurent Schares, Tymon Barwicz, Martin Glodde, Swetha Kamlapurkar, Eric J. Zhang, William M.J. Green, Victor Dolores Calzadilla, Ariane Sigmund, Martin Moehrle

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Abstract

We demonstrate flip-chip solder assembly of InP chips on Silicon-Photonic (Si-Ph) substrates aimed at high volume manufacturing using typical microelectronic lead-free solders. In our show-case application, an InP die is both a light source and a detector in an integrated optical methane gas sensor that operates near 1.6mm. For high-resolution laser absorption spectroscopy sensing, a single-mode tunable laser is desired. We create an external cavity laser with InP as optical gain, butt-coupled to a Si-Ph external cavity, which incorporates the laser's frequency selective elements. For minimal reflection at the InP-Si interface, waveguides are angled to the facet, an index-matching medium is applied between the mating surfaces, and an anti-reflection coating designed for the index-matching medium is applied to the optical coupling facet of InP chip. Sub-micron alignment accuracy is obtained without high-accuracy assembly tooling. Lithographically defined alignment features on both InP and Si components allow reproducible high-accuracy alignment. Interface throughput loss were measured to be as low as 1.4 dB, and interface reflections are more than 30dB smaller than main signal beams.

Original languageEnglish
Title of host publicationProceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages1060-1066
Number of pages7
ISBN (Electronic)978-1-7281-1499-6
DOIs
Publication statusPublished - 1 May 2019
Event69th IEEE Electronic Components and Technology Conference, ECTC 2019 - Las Vegas, United States
Duration: 28 May 201931 May 2019

Conference

Conference69th IEEE Electronic Components and Technology Conference, ECTC 2019
CountryUnited States
CityLas Vegas
Period28/05/1931/05/19

Keywords

  • Flip-chip assembly
  • Heterogeneous assembly
  • Silicon & III-V photonics
  • Solder reflow
  • flip-chip assembly
  • solder reflow
  • heterogeneous assembly

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