Flip-chip III-V-to-silicon photonics interfaces for optical sensor

Yves Martin, Jason S. Orcutt, Chi Xiong, Laurent Schares, Tymon Barwicz, Martin Glodde, Swetha Kamlapurkar, Eric J. Zhang, William M.J. Green, Victor Dolores Calzadilla, Ariane Sigmund, Martin Moehrle

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Abstract

We demonstrate flip-chip solder assembly of InP chips on Silicon-Photonic (Si-Ph) substrates aimed at high volume manufacturing using typical microelectronic lead-free solders. In our show-case application, an InP die is both a light source and a detector in an integrated optical methane gas sensor that operates near 1.6mm. For high-resolution laser absorption spectroscopy sensing, a single-mode tunable laser is desired. We create an external cavity laser with InP as optical gain, butt-coupled to a Si-Ph external cavity, which incorporates the laser's frequency selective elements. For minimal reflection at the InP-Si interface, waveguides are angled to the facet, an index-matching medium is applied between the mating surfaces, and an anti-reflection coating designed for the index-matching medium is applied to the optical coupling facet of InP chip. Sub-micron alignment accuracy is obtained without high-accuracy assembly tooling. Lithographically defined alignment features on both InP and Si components allow reproducible high-accuracy alignment. Interface throughput loss were measured to be as low as 1.4 dB, and interface reflections are more than 30dB smaller than main signal beams.

Original languageEnglish
Title of host publicationProceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages1060-1066
Number of pages7
ISBN (Electronic)978-1-7281-1499-6
DOIs
Publication statusPublished - 1 May 2019
Event69th IEEE Electronic Components and Technology Conference, ECTC 2019 - Las Vegas, United States
Duration: 28 May 201931 May 2019

Conference

Conference69th IEEE Electronic Components and Technology Conference, ECTC 2019
CountryUnited States
CityLas Vegas
Period28/05/1931/05/19

Fingerprint

Optical sensors
Silicon
Photonics
Optical gain
Antireflection coatings
Laser tuning
Laser spectroscopy
Laser resonators
Methane
Laser modes
Chemical sensors
Absorption spectroscopy
Microelectronics
Soldering alloys
Light sources
Waveguides
Throughput
Detectors
Lasers
Substrates

Keywords

  • Flip-chip assembly
  • Heterogeneous assembly
  • Silicon & III-V photonics
  • Solder reflow

Cite this

Martin, Y., Orcutt, J. S., Xiong, C., Schares, L., Barwicz, T., Glodde, M., ... Moehrle, M. (2019). Flip-chip III-V-to-silicon photonics interfaces for optical sensor. In Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019 (pp. 1060-1066). [8811247] Piscataway: Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ECTC.2019.00166
Martin, Yves ; Orcutt, Jason S. ; Xiong, Chi ; Schares, Laurent ; Barwicz, Tymon ; Glodde, Martin ; Kamlapurkar, Swetha ; Zhang, Eric J. ; Green, William M.J. ; Dolores Calzadilla, Victor ; Sigmund, Ariane ; Moehrle, Martin. / Flip-chip III-V-to-silicon photonics interfaces for optical sensor. Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Piscataway : Institute of Electrical and Electronics Engineers, 2019. pp. 1060-1066
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abstract = "We demonstrate flip-chip solder assembly of InP chips on Silicon-Photonic (Si-Ph) substrates aimed at high volume manufacturing using typical microelectronic lead-free solders. In our show-case application, an InP die is both a light source and a detector in an integrated optical methane gas sensor that operates near 1.6mm. For high-resolution laser absorption spectroscopy sensing, a single-mode tunable laser is desired. We create an external cavity laser with InP as optical gain, butt-coupled to a Si-Ph external cavity, which incorporates the laser's frequency selective elements. For minimal reflection at the InP-Si interface, waveguides are angled to the facet, an index-matching medium is applied between the mating surfaces, and an anti-reflection coating designed for the index-matching medium is applied to the optical coupling facet of InP chip. Sub-micron alignment accuracy is obtained without high-accuracy assembly tooling. Lithographically defined alignment features on both InP and Si components allow reproducible high-accuracy alignment. Interface throughput loss were measured to be as low as 1.4 dB, and interface reflections are more than 30dB smaller than main signal beams.",
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author = "Yves Martin and Orcutt, {Jason S.} and Chi Xiong and Laurent Schares and Tymon Barwicz and Martin Glodde and Swetha Kamlapurkar and Zhang, {Eric J.} and Green, {William M.J.} and {Dolores Calzadilla}, Victor and Ariane Sigmund and Martin Moehrle",
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Martin, Y, Orcutt, JS, Xiong, C, Schares, L, Barwicz, T, Glodde, M, Kamlapurkar, S, Zhang, EJ, Green, WMJ, Dolores Calzadilla, V, Sigmund, A & Moehrle, M 2019, Flip-chip III-V-to-silicon photonics interfaces for optical sensor. in Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019., 8811247, Institute of Electrical and Electronics Engineers, Piscataway, pp. 1060-1066, 69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, United States, 28/05/19. https://doi.org/10.1109/ECTC.2019.00166

Flip-chip III-V-to-silicon photonics interfaces for optical sensor. / Martin, Yves; Orcutt, Jason S.; Xiong, Chi; Schares, Laurent; Barwicz, Tymon; Glodde, Martin; Kamlapurkar, Swetha; Zhang, Eric J.; Green, William M.J.; Dolores Calzadilla, Victor; Sigmund, Ariane; Moehrle, Martin.

Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Piscataway : Institute of Electrical and Electronics Engineers, 2019. p. 1060-1066 8811247.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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AU - Glodde, Martin

AU - Kamlapurkar, Swetha

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Martin Y, Orcutt JS, Xiong C, Schares L, Barwicz T, Glodde M et al. Flip-chip III-V-to-silicon photonics interfaces for optical sensor. In Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Piscataway: Institute of Electrical and Electronics Engineers. 2019. p. 1060-1066. 8811247 https://doi.org/10.1109/ECTC.2019.00166