TY - JOUR
T1 - Flexible electronics : prediction of substrate deformation during different steps of the lithography process
AU - Barink, M.
AU - Berg, van den, D.
AU - Yakimets, I.
AU - Giesen, P.T.M.
AU - Dommelen, van, J.A.W.
AU - Meinders, E.
PY - 2011
Y1 - 2011
N2 - A numerical model was developed to simulate the micro deformations of a polymeric substrate due to lithographic processing of different layers of a transistor-like structure. The results of the model were validated with the results from experiments. The model, a mechanical-thermal-hygroscopic model, takes into account the dimensional effects of temperature, moisture and stresses. It also includes the temperature dependent viscoelastic behaviour of the polymer substrate. The model can be used to predict overlay accuracies between different functional layers introduced by the lithographic process. It can also be used to understand the underlying processes such that it provides a tool to improve the overlay accuracy during actual processing.
AB - A numerical model was developed to simulate the micro deformations of a polymeric substrate due to lithographic processing of different layers of a transistor-like structure. The results of the model were validated with the results from experiments. The model, a mechanical-thermal-hygroscopic model, takes into account the dimensional effects of temperature, moisture and stresses. It also includes the temperature dependent viscoelastic behaviour of the polymer substrate. The model can be used to predict overlay accuracies between different functional layers introduced by the lithographic process. It can also be used to understand the underlying processes such that it provides a tool to improve the overlay accuracy during actual processing.
U2 - 10.1016/j.mee.2011.01.004
DO - 10.1016/j.mee.2011.01.004
M3 - Article
VL - 8
SP - 999
EP - 1005
JO - Microelectronic Engineering
JF - Microelectronic Engineering
SN - 0167-9317
IS - 6
ER -