Finite Element Modeling of IGBT Modules to Explore the Correlation between Electric Parameters and Damage in Bond Wires

Maogong Jiang, Guicui Fu, Lorenzo Ceccarelli, He Du, Martin Bendix Fogsgaard, Amir Sajjad Bahman, Yongheng Yang, Francesco Iannuzzo

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

3 Citations (Scopus)

Abstract

This paper proposes a method to identify damage-sensitive electrical parameters (DESPs) for insulated gate bipolar transistor (IGBT) bond wires. Multiphysics simulations are performed to emulate the realistic electrical, thermal and mechanical behaviors of IGBT module. Temperature-dependent material properties are considered in silicon chips and aluminum bond wires. Steady-state electro-thermo-mechanical simulation results of IGBT modules in a given collector current are presented. The degradation mechanisms of wire-bonding crack propagation and complete lift-off are explored. Simulations are validated through the power cycling tests. The trend of measured forward voltage VCE(on) is similar to the simulation result. The modeling method and results can be used to evaluate the health status of IGBT module bond wires.

Original languageEnglish
Title of host publication2019 IEEE Energy Conversion Congress and Exposition, ECCE 2019
PublisherInstitute of Electrical and Electronics Engineers
Pages839-844
Number of pages6
ISBN (Electronic)978-1-7281-0395-2
ISBN (Print)978-1-7281-0396-9
DOIs
Publication statusPublished - Sep 2019
Externally publishedYes
Event11th Annual IEEE Energy Conversion Congress and Exposition (ECCE 2019) - The Baltimore Convention Center, Baltimore, United States
Duration: 29 Sep 20193 Oct 2019
Conference number: 11
http://www.ieee-ecce.org/2019/

Conference

Conference11th Annual IEEE Energy Conversion Congress and Exposition (ECCE 2019)
Abbreviated titleECCE 2019
Country/TerritoryUnited States
CityBaltimore
Period29/09/193/10/19
Internet address

Keywords

  • Bond wires
  • Crack
  • Electric parameter
  • Finite element model
  • IGBT
  • Lift-off

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