Fibre-array pigtailing and packaging of an inp-based optical cross-connect chip

J.H.C. Zantvoort, van; Frans Huijskens; C.G.P. Herben; H. Waardt, de

doi:10.1109/2944.806749

Fibre-array pigtailing and packaging of an inp-based optical cross-connect chip

J.H.C. Zantvoort, van
, Frans Huijskens
, C.G.P. Herben
, H. Waardt, de

Research output: Contribution to journal › Article › Academic › peer-review

9 Citations (Scopus)

283 Downloads (Pure)

Abstract

A method of coupling six single-mode fiber tapers with 250-µm spacing to an InP-based integrated optical cross-connect chip has been developed and realized. The complete pigtailed chip assembly is packaged while chip temperature can be controlled. The device is successful tested at an ambient temperature range of 5°C to 45°C

Original language	English
Pages (from-to)	1255-1259
Number of pages	5
Journal	IEEE Journal of Selected Topics in Quantum Electronics
Volume	5
Issue number	5
DOIs	https://doi.org/10.1109/2944.806749
Publication status	Published - 1999

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title = "Fibre-array pigtailing and packaging of an inp-based optical cross-connect chip",

abstract = "A method of coupling six single-mode fiber tapers with 250-µm spacing to an InP-based integrated optical cross-connect chip has been developed and realized. The complete pigtailed chip assembly is packaged while chip temperature can be controlled. The device is successful tested at an ambient temperature range of 5°C to 45°C",

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AU - Huijskens, Frans

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AU - Waardt, de, H.

PY - 1999

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AB - A method of coupling six single-mode fiber tapers with 250-µm spacing to an InP-based integrated optical cross-connect chip has been developed and realized. The complete pigtailed chip assembly is packaged while chip temperature can be controlled. The device is successful tested at an ambient temperature range of 5°C to 45°C

U2 - 10.1109/2944.806749

DO - 10.1109/2944.806749

M3 - Article

SN - 1077-260X

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SP - 1255

EP - 1259

JO - IEEE Journal of Selected Topics in Quantum Electronics

JF - IEEE Journal of Selected Topics in Quantum Electronics

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Fibre-array pigtailing and packaging of an inp-based optical cross-connect chip

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