Fibre-array pigtailing and packaging of an inp-based optical cross-connect chip

J.H.C. Zantvoort, van, Frans Huijskens, C.G.P. Herben, H. Waardt, de

Research output: Contribution to journalArticleAcademicpeer-review

9 Citations (Scopus)
94 Downloads (Pure)

Abstract

A method of coupling six single-mode fiber tapers with 250-µm spacing to an InP-based integrated optical cross-connect chip has been developed and realized. The complete pigtailed chip assembly is packaged while chip temperature can be controlled. The device is successful tested at an ambient temperature range of 5°C to 45°C
Original languageEnglish
Pages (from-to)1255-1259
Number of pages5
JournalIEEE Journal of Selected Topics in Quantum Electronics
Volume5
Issue number5
DOIs
Publication statusPublished - 1999

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