Fibre array packaging and pigtailing of an integrated InP-InGaAsP two-state multiwavelength laser chip

J.H.C. Zantvoort, van; S.G.L. Plukker; M.T. Hill; E. Smalbrugge; Erwin Dekkers; G.D. Khoe; A.M.J. Koonen; H. Waardt, de

Fibre array packaging and pigtailing of an integrated InP-InGaAsP two-state multiwavelength laser chip

J.H.C. Zantvoort, van, S.G.L. Plukker, M.T. Hill, E. Smalbrugge, Erwin Dekkers, G.D. Khoe, A.M.J. Koonen, H. Waardt, de

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Abstract

A mechanical sub-assembly is presented enabling fine positioning and fixation of a lensed 4-fibre array to an integrated two-state AWG-based multiwavelength laser chip. The device operates as an all optical memory element used in optical packet switching and signal processing. The alignment accuracy between fibre array and chip is in the sub-micron range and possible in 4 degrees of freedom. The design minimizes postweld-shifts and enables re-positioning of the fibre array after the first fixation step. The mechanical sub-assembly is mounted in a package with a clamp method to reduce internal stress in the sub-assembly. The chip temperature is varied from 10 *C to 30 *C and stable coupling efficiency is measured.

Original language	English
Title of host publication	Proceedings of the 10th Annual Symposium IEEE/LEOS Benelux Chapter, 1-2 December 2005, Mons, Belgium
Editors	P. Mégret, M. Wuilpart, S. Bette, N. Staquet
Place of Publication	Mons
Publisher	IEEE/LEOS
Pages	217-220
ISBN (Print)	2-960022645
Publication status	Published - 2005
Event	10th Annual Symposium of the IEEE/LEOS Benelux Chapter, December 1-2, 2005, Mons, Belgium - Mons, Belgium Duration: 1 Dec 2005 → 2 Dec 2005

Conference

Conference	10th Annual Symposium of the IEEE/LEOS Benelux Chapter, December 1-2, 2005, Mons, Belgium
Country/Territory	Belgium
City	Mons
Period	1/12/05 → 2/12/05

Cite this

Zantvoort, van, J. H. C., Plukker, S. G. L., Hill, M. T., Smalbrugge, E., Dekkers, E., Khoe, G. D., Koonen, A. M. J., & Waardt, de, H. (2005). Fibre array packaging and pigtailing of an integrated InP-InGaAsP two-state multiwavelength laser chip. In P. Mégret, M. Wuilpart, S. Bette, & N. Staquet (Eds.), Proceedings of the 10th Annual Symposium IEEE/LEOS Benelux Chapter, 1-2 December 2005, Mons, Belgium (pp. 217-220). IEEE/LEOS.

@inproceedings{202013265acb4685ad1224b87c673504,

title = "Fibre array packaging and pigtailing of an integrated InP-InGaAsP two-state multiwavelength laser chip",

abstract = "A mechanical sub-assembly is presented enabling fine positioning and fixation of a lensed 4-fibre array to an integrated two-state AWG-based multiwavelength laser chip. The device operates as an all optical memory element used in optical packet switching and signal processing. The alignment accuracy between fibre array and chip is in the sub-micron range and possible in 4 degrees of freedom. The design minimizes postweld-shifts and enables re-positioning of the fibre array after the first fixation step. The mechanical sub-assembly is mounted in a package with a clamp method to reduce internal stress in the sub-assembly. The chip temperature is varied from 10 *C to 30 *C and stable coupling efficiency is measured.",

author = "{Zantvoort, van}, J.H.C. and S.G.L. Plukker and M.T. Hill and E. Smalbrugge and Erwin Dekkers and G.D. Khoe and A.M.J. Koonen and {Waardt, de}, H.",

year = "2005",

language = "English",

isbn = "2-960022645",

pages = "217--220",

editor = "P. M{\'e}gret and M. Wuilpart and S. Bette and N. Staquet",

booktitle = "Proceedings of the 10th Annual Symposium IEEE/LEOS Benelux Chapter, 1-2 December 2005, Mons, Belgium",

publisher = "IEEE/LEOS",

note = "10th Annual Symposium of the IEEE/LEOS Benelux Chapter, December 1-2, 2005, Mons, Belgium ; Conference date: 01-12-2005 Through 02-12-2005",

}

Zantvoort, van, JHC, Plukker, SGL, Hill, MT, Smalbrugge, E, Dekkers, E, Khoe, GD , Koonen, AMJ & Waardt, de, H 2005, Fibre array packaging and pigtailing of an integrated InP-InGaAsP two-state multiwavelength laser chip. in P Mégret, M Wuilpart, S Bette & N Staquet (eds), Proceedings of the 10th Annual Symposium IEEE/LEOS Benelux Chapter, 1-2 December 2005, Mons, Belgium. IEEE/LEOS, Mons, pp. 217-220, 10th Annual Symposium of the IEEE/LEOS Benelux Chapter, December 1-2, 2005, Mons, Belgium, Mons, Belgium, 1/12/05.

Fibre array packaging and pigtailing of an integrated InP-InGaAsP two-state multiwavelength laser chip. / Zantvoort, van, J.H.C.; Plukker, S.G.L.; Hill, M.T. et al.
Proceedings of the 10th Annual Symposium IEEE/LEOS Benelux Chapter, 1-2 December 2005, Mons, Belgium. ed. / P. Mégret; M. Wuilpart; S. Bette; N. Staquet. Mons: IEEE/LEOS, 2005. p. 217-220.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Fibre array packaging and pigtailing of an integrated InP-InGaAsP two-state multiwavelength laser chip

AU - Zantvoort, van, J.H.C.

AU - Plukker, S.G.L.

AU - Hill, M.T.

AU - Smalbrugge, E.

AU - Dekkers, Erwin

AU - Khoe, G.D.

AU - Koonen, A.M.J.

AU - Waardt, de, H.

PY - 2005

Y1 - 2005

N2 - A mechanical sub-assembly is presented enabling fine positioning and fixation of a lensed 4-fibre array to an integrated two-state AWG-based multiwavelength laser chip. The device operates as an all optical memory element used in optical packet switching and signal processing. The alignment accuracy between fibre array and chip is in the sub-micron range and possible in 4 degrees of freedom. The design minimizes postweld-shifts and enables re-positioning of the fibre array after the first fixation step. The mechanical sub-assembly is mounted in a package with a clamp method to reduce internal stress in the sub-assembly. The chip temperature is varied from 10 *C to 30 *C and stable coupling efficiency is measured.

AB - A mechanical sub-assembly is presented enabling fine positioning and fixation of a lensed 4-fibre array to an integrated two-state AWG-based multiwavelength laser chip. The device operates as an all optical memory element used in optical packet switching and signal processing. The alignment accuracy between fibre array and chip is in the sub-micron range and possible in 4 degrees of freedom. The design minimizes postweld-shifts and enables re-positioning of the fibre array after the first fixation step. The mechanical sub-assembly is mounted in a package with a clamp method to reduce internal stress in the sub-assembly. The chip temperature is varied from 10 *C to 30 *C and stable coupling efficiency is measured.

M3 - Conference contribution

SN - 2-960022645

SP - 217

EP - 220

BT - Proceedings of the 10th Annual Symposium IEEE/LEOS Benelux Chapter, 1-2 December 2005, Mons, Belgium

A2 - Mégret, P.

A2 - Wuilpart, M.

A2 - Bette, S.

A2 - Staquet, N.

PB - IEEE/LEOS

CY - Mons

T2 - 10th Annual Symposium of the IEEE/LEOS Benelux Chapter, December 1-2, 2005, Mons, Belgium

Y2 - 1 December 2005 through 2 December 2005

ER -

Zantvoort, van JHC, Plukker SGL, Hill MT, Smalbrugge E, Dekkers E, Khoe GD et al. Fibre array packaging and pigtailing of an integrated InP-InGaAsP two-state multiwavelength laser chip. In Mégret P, Wuilpart M, Bette S, Staquet N, editors, Proceedings of the 10th Annual Symposium IEEE/LEOS Benelux Chapter, 1-2 December 2005, Mons, Belgium. Mons: IEEE/LEOS. 2005. p. 217-220

Fibre array packaging and pigtailing of an integrated InP-InGaAsP two-state multiwavelength laser chip

Abstract

Conference

Fingerprint

Cite this