Abstract
A concept for coupling lensed fiber arrays to photonic optical chips in the submicrometer range by using metal deformation is presented. Fine-tuning is possible despite already secured positions between the parts due to precisely chosen step-by-step deformations in the constructions. The smallest fine-tuning step of 0.1 um is measured using laser support adjustment. The system is packaged and can be temperature controlled. At a constant chip temperature of 22 degrees C, the package is successfully tested at an ambient temperature range of 0 to 60 degrees C.
Original language | English |
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Pages (from-to) | 1331-1340 |
Number of pages | 10 |
Journal | IEEE Journal of Selected Topics in Quantum Electronics |
Volume | 8 |
Issue number | 6 |
DOIs | |
Publication status | Published - 2002 |