Fatigue damage modelling in solder interconnections: a cohesive zone approach

A.J.J. Abdul Baqi, P.J.G. Schreurs, M.G.D. Geers

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

Original languageEnglish
Title of host publicationProceedings of the conference EuroSimE 2003, 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003
EditorsL.J. Ernst
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
ISBN (Print)0-7803-7056-2
Publication statusPublished - 2003

Cite this

Abdul Baqi, A. J. J., Schreurs, P. J. G., & Geers, M. G. D. (2003). Fatigue damage modelling in solder interconnections: a cohesive zone approach. In L. J. Ernst (Ed.), Proceedings of the conference EuroSimE 2003, 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems : Aix-en-Provence, France, March 30 - April 2, 2003 Institute of Electrical and Electronics Engineers.