Fast deposition of plasma polymer layers

J.J. Beulens, P.C.N. Crouzen, G.M.W. Kroesen, H. Vasmel, C.B. Beijer, D.C. Schram, H.J.A. Schuurmans, C.J. Timmermans, J. Werner

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A detailed study has been undertaken to investigate the dependencies of particle and power fluxes on the parameters of the deposition process and the relation with the quality of the deposited layers. The conclusions on this part of the work are: (1) The heat transfer to the substrate increases with the arc power and the argon flow in the arc. (2) The deposition rate increases with the arc power, the argon flow and the toluene flow. (3) The specific deposition rate increases strongly with arc power. These observations can qualitatively be explained as follows. The arc injects a partially ionized plasma of 0.5-1 eV temperature. The ion fraction can charge exchange with toluene molecules leading to atomic ions or radical formation by subsequent dissociative recombination. These radicals are the active species in the deposition process. Hence higher arc power involving a higher ionization degree in the argon flow leads to a larger deposition rate.
Original languageEnglish
Title of host publicationProceedings of the ACS Division of Polymeric Materials: Science and Engineering; Boston, MA, USA; 1 April 1990 through 1 April 1990
Publication statusPublished - 1990
EventACS Division of Polymeric Materials: Science and Engineering, April 1, 1990, Boston, MA, USA - Boston, United States
Duration: 1 Apr 19901 Apr 1990

Publication series

NamePolymeric Materials: Science and Engineering
ISSN (Print)0743-0515


ConferenceACS Division of Polymeric Materials: Science and Engineering, April 1, 1990, Boston, MA, USA
Country/TerritoryUnited States


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