Failure sensitivity modelling of 3D bond pad structures

O. Sluis, van der; R.B.R. Silfhout, van; P.H.M. Timmermans; W.D. Driel, van; G.Q. Zhang

Failure sensitivity modelling of 3D bond pad structures

O. Sluis, van der
, R.B.R. Silfhout, van
, P.H.M. Timmermans
, W.D. Driel, van
, G.Q. Zhang

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Academic

Original language	English
Title of host publication	Smart Systems Integration and Reliability
Subtitle of host publication	honorary volume on the occasion of Herbert Reichel’s 65th birthday
Editors	B. Michel, K.-D. Lang
Place of Publication	Dresden
Publisher	Goldenbogen Verlag
Pages	614-623
ISBN (Print)	978-3-932434-77-8
Publication status	Published - 2010

Cite this

@inbook{23d3a521db5b4e20b13a243fd5aceabc,

title = "Failure sensitivity modelling of 3D bond pad structures",

author = "\{Sluis, van der\}, O. and \{Silfhout, van\}, R.B.R. and P.H.M. Timmermans and \{Driel, van\}, W.D. and G.Q. Zhang",

year = "2010",

language = "English",

isbn = "978-3-932434-77-8",

pages = "614--623",

editor = "B. Michel and K.-D. Lang",

booktitle = "Smart Systems Integration and Reliability",

publisher = "Goldenbogen Verlag",

}

Failure sensitivity modelling of 3D bond pad structures. / Sluis, van der, O.; Silfhout, van, R.B.R.; Timmermans, P.H.M. et al.
Smart Systems Integration and Reliability: honorary volume on the occasion of Herbert Reichel’s 65th birthday. ed. / B. Michel; K.-D. Lang. Dresden: Goldenbogen Verlag, 2010. p. 614-623.

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Academic

TY - CHAP

T1 - Failure sensitivity modelling of 3D bond pad structures

AU - Sluis, van der, O.

AU - Silfhout, van, R.B.R.

AU - Timmermans, P.H.M.

AU - Driel, van, W.D.

AU - Zhang, G.Q.

PY - 2010

Y1 - 2010

M3 - Chapter

SN - 978-3-932434-77-8

SP - 614

EP - 623

BT - Smart Systems Integration and Reliability

A2 - Michel, B.

A2 - Lang, K.-D.

PB - Goldenbogen Verlag

CY - Dresden

ER -