Failure sensitivity modelling of 3D bond pad structures

O. Sluis, van der, R.B.R. Silfhout, van, P.H.M. Timmermans, W.D. Driel, van, G.Q. Zhang

Research output: Chapter in Book/Report/Conference proceedingChapterAcademic

Original languageEnglish
Title of host publicationSmart System Integration and Reliability (honorary volume on the occasion of Herbert Reichel’s 65th birthday)
EditorsB. Michel, K.-D. Lang
PublisherGoldenbogen Verlag
ISBN (Print)978-3-932434-77-8
Publication statusPublished - 2010

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