Fabrication of etched facets and vertical couplers in InP for packaging and on-wafer test

Rui Lemos Alvares Dos Santos; D. D'Agostino; F. M. Soares; H. Rabbani Haghighi; K. A. Williams; X. J. M. Leijtens

doi:10.1109/LPT.2015.2493583

Fabrication of etched facets and vertical couplers in InP for packaging and on-wafer test

Rui Lemos Alvares Dos Santos, D. D'Agostino, F. M. Soares, H. Rabbani Haghighi, K. A. Williams, X. J. M. Leijtens

Photonic Integration

Research output: Contribution to journal › Article › Academic › peer-review

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Abstract

In this letter, the fabrication and the characterization of angled and straight etched facets in InP-based technology are reported. In addition, we report on etched facets combined with coupler mirrors for vertical outcoupling, realized with a wet-etching process.

Original language	English
Pages (from-to)	245-247
Journal	IEEE Photonics Technology Letters
Volume	28
Issue number	3
DOIs	https://doi.org/10.1109/LPT.2015.2493583
Publication status	Published - 1 Feb 2016

Keywords

Photonic integrated circuit (PIC)
etched facets
vertical couplers
on-wafer testing

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10.1109/LPT.2015.2493583

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@article{4519e49a38b24ae8b441109692419365,

title = "Fabrication of etched facets and vertical couplers in InP for packaging and on-wafer test",

abstract = "In this letter, the fabrication and the characterization of angled and straight etched facets in InP-based technology are reported. In addition, we report on etched facets combined with coupler mirrors for vertical outcoupling, realized with a wet-etching process.",

keywords = "Photonic integrated circuit (PIC), etched facets, vertical couplers, on-wafer testing",

author = "\{Lemos Alvares Dos Santos\}, Rui and D. D'Agostino and Soares, \{F. M.\} and Haghighi, \{H. Rabbani\} and Williams, \{K. A.\} and Leijtens, \{X. J. M.\}",

year = "2016",

month = feb,

day = "1",

doi = "10.1109/LPT.2015.2493583",

language = "English",

volume = "28",

pages = "245--247",

journal = "IEEE Photonics Technology Letters",

issn = "1041-1135",

publisher = "Institute of Electrical and Electronics Engineers",

number = "3",

}

TY - JOUR

T1 - Fabrication of etched facets and vertical couplers in InP for packaging and on-wafer test

AU - Lemos Alvares Dos Santos, Rui

AU - D'Agostino, D.

AU - Soares, F. M.

AU - Haghighi, H. Rabbani

AU - Williams, K. A.

AU - Leijtens, X. J. M.

PY - 2016/2/1

Y1 - 2016/2/1

N2 - In this letter, the fabrication and the characterization of angled and straight etched facets in InP-based technology are reported. In addition, we report on etched facets combined with coupler mirrors for vertical outcoupling, realized with a wet-etching process.

AB - In this letter, the fabrication and the characterization of angled and straight etched facets in InP-based technology are reported. In addition, we report on etched facets combined with coupler mirrors for vertical outcoupling, realized with a wet-etching process.

KW - Photonic integrated circuit (PIC)

KW - etched facets

KW - vertical couplers

KW - on-wafer testing

U2 - 10.1109/LPT.2015.2493583

DO - 10.1109/LPT.2015.2493583

M3 - Article

SN - 1041-1135

VL - 28

SP - 245

EP - 247

JO - IEEE Photonics Technology Letters

JF - IEEE Photonics Technology Letters

IS - 3

ER -

Fabrication of etched facets and vertical couplers in InP for packaging and on-wafer test

Abstract

Keywords

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