Fabrication of etched facets and vertical couplers in InP for packaging and on-wafer test

Rui Lemos Alvares Dos Santos, D. D'Agostino, F. M. Soares, H. Rabbani Haghighi, K. A. Williams, X. J. M. Leijtens

Research output: Contribution to journalArticleAcademicpeer-review

5 Citations (Scopus)
28 Downloads (Pure)

Abstract

In this letter, the fabrication and the characterization of angled and straight etched facets in InP-based technology are reported. In addition, we report on etched facets combined with coupler mirrors for vertical outcoupling, realized with a wet-etching process.
Original languageEnglish
Pages (from-to)245-247
JournalIEEE Photonics Technology Letters
Volume28
Issue number3
DOIs
Publication statusPublished - 1 Feb 2016

Keywords

  • Photonic integrated circuit (PIC)
  • etched facets
  • vertical couplers
  • on-wafer testing

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