Abstract
This paper reports the progress on the fabrication process of highly efficient metal grating couplers for membrane-based integrated circuits, using double side processing technology on bonded samples. This type of gratings comprises a buried SiO2/Ag grating of 125nm thickness with a silver layer as metal mirror, and has several advantages over dielectric gratings as metallic gratings are independent from the buffer thickness. We predict a theoretical chip-to-fiber coupling efficiency of 74% and 89% for uniform and apodized gratings respectively, at a wavelength of 1550 nm. Furthermore, the fabrication process can be used for both, SOI and III-V based platforms.
Original language | English |
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Title of host publication | Proceedings of the 19th Annual Symposium of the IEEE Photonics Society Benelux Chapter, 3-4 November 2014, Enschede, The Netherlands |
Editors | S Garcia-Blanco, K.J. Boller, D Douwe Geuzerbroek |
Place of Publication | Enschede |
Publisher | Twente University |
Pages | 51-54 |
ISBN (Print) | 978-90-365-3778-0 |
Publication status | Published - 2014 |