Abstract
The increasing complexity of integrated optical devices not only puts stringent requirements on the uniformity of the fabrication process but also results in larger device dimensions. An approach to reduce the effect of the process non-uniformities and increase the yield per wafer is the use of compact components. We report an extremely compact 4-channel 2´2 WDM cross-connect covering only 3.3´1.5 mm2. The device consist of low-loss compact PHASAR (de)multiplexers and compact push-pull Mach-Zehnder interferometer switches. The crosstalk performance is better than –20 dB and the on-chip loss is less than 12 dB. These results are comparable to the best InP-based WDM cross-connects reported so far but with much smaller dimensions.
| Original language | English |
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| Title of host publication | Proceedings of the 5th annual symposium of the IEEE/LEOS Benelux Chapter : October 30, 2000, Delft , the Netherlands |
| Editors | X.J.M. Leijtens, J.H. Besten, den |
| Place of Publication | Delft |
| Publisher | Technische Universiteit Delft |
| Pages | 17-20 |
| ISBN (Print) | 90-9014260-6 |
| Publication status | Published - 2000 |
| Event | 5th Annual Symposium of the IEEE/LEOS Benelux Chapter - Delft, Netherlands Duration: 30 Oct 2000 → 30 Oct 2000 |
Conference
| Conference | 5th Annual Symposium of the IEEE/LEOS Benelux Chapter |
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| Country/Territory | Netherlands |
| City | Delft |
| Period | 30/10/00 → 30/10/00 |
| Other | IEEE/LEOS symposium |