Exploring the reconstruction of a finite dielectric frustum-shaped object by the parametrized spatial spectral volume integral equation

Soft X-ray scatterometry has the potential for sub-nm and three-dimensional profiling of integrated circuits, but the associated scatterometry measurements are prone to low signal-to-noise levels. We extend a two-dimensional parametrization framework of an accurate and noise-robust inverse-scattering method for three-dimensional finite dielectric objects, to include a three- dimensional parametrization in the form of a sidewall-angle extension. This is tested against synthetic inverse scattering data under high-noise conditions.