Expanding thermal plasma for low-k dielectrics deposition

Chemistry

• Dielectric Material 100%
• Liquid Film 100%
• Procedure 50%
• Mixture 50%
• Engineering Process 50%
• Mechanical Property 50%
• Dioxygen 50%
• Argon 50%
• Carbon 50%
• Hardness 50%
• Electrical Property 50%
• Silicon Dioxide 50%
• Hexamethyldisiloxane 50%

Material Science

• Dielectric Material 100%
• Mixture 50%
• Mechanical Property 50%
• Argon 50%
• Hardness 50%
• Novel Material 50%
• Electrical Property 50%
• Silicon Dioxide 50%