Embedded multi-detect ATPG and its effect on the detection of unmodeled defects

J. Geuzebroek, E.J. Marinissen, A. Majhi, A. Glowatz, F. Hapke

Research output: Chapter in Book/Report/Conference proceedingChapterAcademicpeer-review

55 Citations (Scopus)

Abstract

The demand for higher quality requires more effective testing to filter out the bad devices. It is already known that multi-detection of single stuck-at faults results in more fortuitous detections of defects not behaving as stuck-at faults, which increases the test quality. Existing multi-detect tests, i.e., the well-known n-detect tests, suffer from significant test size increases. This paper shows that embedding multi-detection of faults within regular ATPG patterns results in a higher quality without a significant increase in test set size. High-volume silicon measurement results demonstrate that embedded multi-detect tests detect 2.3% to 4.7% more defective devices than conventional single-detect stuck-at tests.
Original languageEnglish
Title of host publication2007 IEEE International Test Conference
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Number of pages10
ISBN (Print)978-1-4244-1127-6
DOIs
Publication statusPublished - 2007
Externally publishedYes
Event10th Design, Automation and Test in Europe Conference and Exhibition (DATE 2007) - Acropolis, Nice, France
Duration: 16 Apr 200720 Apr 2007
Conference number: 10

Conference

Conference10th Design, Automation and Test in Europe Conference and Exhibition (DATE 2007)
Abbreviated titleDATE 2007
Country/TerritoryFrance
CityNice
Period16/04/0720/04/07

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