Abstract
The demand for higher quality requires more effective testing to filter out the bad devices. It is already known that multi-detection of single stuck-at faults results in more fortuitous detections of defects not behaving as stuck-at faults, which increases the test quality. Existing multi-detect tests, i.e., the well-known n-detect tests, suffer from significant test size increases. This paper shows that embedding multi-detection of faults within regular ATPG patterns results in a higher quality without a significant increase in test set size. High-volume silicon measurement results demonstrate that embedded multi-detect tests detect 2.3% to 4.7% more defective devices than conventional single-detect stuck-at tests.
Original language | English |
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Title of host publication | 2007 IEEE International Test Conference |
Place of Publication | Piscataway |
Publisher | Institute of Electrical and Electronics Engineers |
Number of pages | 10 |
ISBN (Print) | 978-1-4244-1127-6 |
DOIs | |
Publication status | Published - 2007 |
Externally published | Yes |
Event | 10th Design, Automation and Test in Europe Conference and Exhibition (DATE 2007) - Acropolis, Nice, France Duration: 16 Apr 2007 → 20 Apr 2007 Conference number: 10 |
Conference
Conference | 10th Design, Automation and Test in Europe Conference and Exhibition (DATE 2007) |
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Abbreviated title | DATE 2007 |
Country/Territory | France |
City | Nice |
Period | 16/04/07 → 20/04/07 |