Electroplating of gold using a sulfite-based electrolyte

E. Smalbrugge; B. Jacobs; S. Falcone; E.J. Geluk; F. Karouta

Electroplating of gold using a sulfite-based electrolyte

E. Smalbrugge
, B. Jacobs
, S. Falcone
, E.J. Geluk
, F. Karouta

Photonic Integration

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

930 Downloads (Pure)

Abstract

Electroplating of gold is often used in optoelectronic and microelectronic devices for air-bridges, heat-sinks or gold-bumps for flip-chip techniques. The gold-cyanide electrolytes, which are commonly used in gold-electroplating, are toxic and attack resist patterns causing cracks during the plating process. In this paper we report our experimental results of gold-electroplating using a sulfite-based electrolyte (NH4)3{Au(SO3)2}. This product is environment- and userfriendly and moreover the electroplating rate is good (10-50 µm/hour). Results varying current density and stirring rate will be reported.

Original language	English
Title of host publication	Proceedings of the 5th annual symposium of the IEEE/LEOS Benelux Chapter : October 30, 2000, Delft , the Netherlands
Editors	X.J.M. Leijtens, J.H. Besten, den
Place of Publication	Delft
Publisher	Technische Universiteit Delft
Pages	143-146
ISBN (Print)	90-9014260.6
Publication status	Published - 2000
Event	5th Annual Symposium of the IEEE/LEOS Benelux Chapter - Delft, Netherlands Duration: 30 Oct 2000 → 30 Oct 2000

Conference

Conference	5th Annual Symposium of the IEEE/LEOS Benelux Chapter
Country/Territory	Netherlands
City	Delft
Period	30/10/00 → 30/10/00
Other	IEEE/LEOS symposium

Access to Document

publishers versionFinal published version, 207 KB

Cite this

@inproceedings{039fb62739ab45a9911b9fe0118a4f5b,

title = "Electroplating of gold using a sulfite-based electrolyte",

abstract = "Electroplating of gold is often used in optoelectronic and microelectronic devices for air-bridges, heat-sinks or gold-bumps for flip-chip techniques. The gold-cyanide electrolytes, which are commonly used in gold-electroplating, are toxic and attack resist patterns causing cracks during the plating process. In this paper we report our experimental results of gold-electroplating using a sulfite-based electrolyte (NH4)3\{Au(SO3)2\}. This product is environment- and userfriendly and moreover the electroplating rate is good (10-50 µm/hour). Results varying current density and stirring rate will be reported.",

author = "E. Smalbrugge and B. Jacobs and S. Falcone and E.J. Geluk and F. Karouta",

year = "2000",

language = "English",

isbn = "90-9014260.6",

pages = "143--146",

editor = "X.J.M. Leijtens and \{Besten, den\}, J.H.",

booktitle = "Proceedings of the 5th annual symposium of the IEEE/LEOS Benelux Chapter : October 30, 2000, Delft , the Netherlands",

publisher = "Technische Universiteit Delft",

address = "Netherlands",

note = "5th Annual Symposium of the IEEE/LEOS Benelux Chapter ; Conference date: 30-10-2000 Through 30-10-2000",

}

Smalbrugge, E, Jacobs, B, Falcone, S, Geluk, EJ & Karouta, F 2000, Electroplating of gold using a sulfite-based electrolyte. in XJM Leijtens & JH Besten, den (eds), Proceedings of the 5th annual symposium of the IEEE/LEOS Benelux Chapter : October 30, 2000, Delft , the Netherlands. Technische Universiteit Delft, Delft, pp. 143-146, 5th Annual Symposium of the IEEE/LEOS Benelux Chapter, Delft, Netherlands, 30/10/00.

Electroplating of gold using a sulfite-based electrolyte. / Smalbrugge, E.; Jacobs, B.; Falcone, S. et al.
Proceedings of the 5th annual symposium of the IEEE/LEOS Benelux Chapter : October 30, 2000, Delft , the Netherlands. ed. / X.J.M. Leijtens; J.H. Besten, den. Delft: Technische Universiteit Delft, 2000. p. 143-146.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Electroplating of gold using a sulfite-based electrolyte

AU - Smalbrugge, E.

AU - Jacobs, B.

AU - Falcone, S.

AU - Geluk, E.J.

AU - Karouta, F.

PY - 2000

Y1 - 2000

N2 - Electroplating of gold is often used in optoelectronic and microelectronic devices for air-bridges, heat-sinks or gold-bumps for flip-chip techniques. The gold-cyanide electrolytes, which are commonly used in gold-electroplating, are toxic and attack resist patterns causing cracks during the plating process. In this paper we report our experimental results of gold-electroplating using a sulfite-based electrolyte (NH4)3{Au(SO3)2}. This product is environment- and userfriendly and moreover the electroplating rate is good (10-50 µm/hour). Results varying current density and stirring rate will be reported.

AB - Electroplating of gold is often used in optoelectronic and microelectronic devices for air-bridges, heat-sinks or gold-bumps for flip-chip techniques. The gold-cyanide electrolytes, which are commonly used in gold-electroplating, are toxic and attack resist patterns causing cracks during the plating process. In this paper we report our experimental results of gold-electroplating using a sulfite-based electrolyte (NH4)3{Au(SO3)2}. This product is environment- and userfriendly and moreover the electroplating rate is good (10-50 µm/hour). Results varying current density and stirring rate will be reported.

M3 - Conference contribution

SN - 90-9014260.6

SP - 143

EP - 146

BT - Proceedings of the 5th annual symposium of the IEEE/LEOS Benelux Chapter : October 30, 2000, Delft , the Netherlands

A2 - Leijtens, X.J.M.

A2 - Besten, den, J.H.

PB - Technische Universiteit Delft

CY - Delft

T2 - 5th Annual Symposium of the IEEE/LEOS Benelux Chapter

Y2 - 30 October 2000 through 30 October 2000

ER -

Electroplating of gold using a sulfite-based electrolyte

Abstract

Conference

Access to Document

Fingerprint

Cite this