Electroplating of gold using a sulfite-based electrolyte

E. Smalbrugge, B. Jacobs, S. Falcone, E.J. Geluk, F. Karouta

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Electroplating of gold is often used in optoelectronic and microelectronic devices for air-bridges, heat-sinks or gold-bumps for flip-chip techniques. The gold-cyanide electrolytes, which are commonly used in gold-electroplating, are toxic and attack resist patterns causing cracks during the plating process. In this paper we report our experimental results of gold-electroplating using a sulfite-based electrolyte (NH4)3{Au(SO3)2}. This product is environment- and userfriendly and moreover the electroplating rate is good (10-50 µm/hour). Results varying current density and stirring rate will be reported.
Original languageEnglish
Title of host publicationProceedings of the 5th annual symposium of the IEEE/LEOS Benelux Chapter : October 30, 2000, Delft , the Netherlands
EditorsX.J.M. Leijtens, J.H. Besten, den
Place of PublicationDelft
PublisherTechnische Universiteit Delft
ISBN (Print)90-9014260.6
Publication statusPublished - 2000
Event5th Annual Symposium of the IEEE/LEOS Benelux Chapter - Delft, Netherlands
Duration: 30 Oct 200030 Oct 2000


Conference5th Annual Symposium of the IEEE/LEOS Benelux Chapter
OtherIEEE/LEOS symposium


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