Efficient damage sensitivity analysis in advanced Cu/Low-k bond pad structures using area release energy

Engineering

• Energy Release 100%
• End Structure 100%
• Energy Engineering 60%
• Delamination 40%
• Good Agreement 20%
• Early Stage 20%
• Interconnects 20%
• Applicability 20%
• Structural Reliability 20%
• Multiscale 20%
• Length Scale 20%
• Experimental Observation 20%
• Layered Structure 20%
• Interfacial Adhesion 20%
• Mechanical Design 20%
• Dimensional Structure 20%
• Mechanical Force 20%
• Process Development 20%
• Critical Location 20%
• Bonding Wire 20%
• Defect Size 20%
• Sensitivity Indicator 20%
• End Process 20%
• Crack Initiation 20%
• Virtual Prototyping 20%
• Dielectrics 20%
• Finite Element Method 20%
• Fracture Mechanics 20%
• Design Phase 20%
• Optimization Technique 20%