Effects of infrared preheat on polyacrylate resist/copper substrate adhesion during fuser roller lamination

E.S.W. Kong, H. Obermaier, P. Piet, P. Avery, J. Buiz

Research output: Contribution to journal › Article › Academic › peer-review

Original language	English
Pages (from-to)	109-113
Number of pages	5
Journal	Polymeric Materials: Science and Engineering
Volume	55
DOIs	https://doi.org/10.1016/0025-5416(82)90089-1
Publication status	Published - 1986

Access to Document

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title = "Effects of infrared preheat on polyacrylate resist/copper substrate adhesion during fuser roller lamination",

author = "E.S.W. Kong and H. Obermaier and P. Piet and P. Avery and J. Buiz",

year = "1986",

doi = "10.1016/0025-5416(82)90089-1",

language = "English",

volume = "55",

pages = "109--113",

journal = "Polymeric Materials: Science and Engineering",

issn = "0743-0515",

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TY - JOUR

T1 - Effects of infrared preheat on polyacrylate resist/copper substrate adhesion during fuser roller lamination

AU - Kong, E.S.W.

AU - Obermaier, H.

AU - Piet, P.

AU - Avery, P.

AU - Buiz, J.

PY - 1986

Y1 - 1986

U2 - 10.1016/0025-5416(82)90089-1

DO - 10.1016/0025-5416(82)90089-1

M3 - Article

SN - 0743-0515

VL - 55

SP - 109

EP - 113

JO - Polymeric Materials: Science and Engineering

JF - Polymeric Materials: Science and Engineering

ER -