Effect of aging of packaging materials on die surface cracking of a SiP carrier

X.S. Ma; K.M.B. Jansen; L.J. Ernst; W.D. Driel, van; O. Sluis, van der; G.Q. Zhang; C. Regard; C. Gautier; H. Fremont

doi:10.1109/ESIME.2008.4525097

Effect of aging of packaging materials on die surface cracking of a SiP carrier

X.S. Ma, K.M.B. Jansen, L.J. Ernst, W.D. Driel, van, O. Sluis, van der, G.Q. Zhang, C. Regard, C. Gautier, H. Fremont

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

2 Citations (Scopus)

Abstract

Generally, the viscoelastic properties of packaging materials used in the simulation models are obtained from the materials after postcuring. However these properties were observed to change during humidity conditioning and the thermal cycling. Two kinds of packaging materials are tested, one is molding compound and another is underfill. All samples are cured according to the curing procedure, postcured at 180degC. Before the test, first the samples are pre-dried at 125degC for 24 hours and then preconditioned at 60degC/60%RH for 40 hours. Secondly, one reflow at 260degC. Finally, all samples are subjected to thermal cycling. Thermal cycling temperature range is from -65degC to 150degC and every cycle is finished in 30 minutes. For the DMA test, a TA Instrument Q800 is used. Test results show the glass modulus, rubber modulus and glass transition temperature increase with the number of thermal cycles. This change in materials after humidity and thermal treatment is here referred to as aging. The finite element software Marc is used to simulate the internal change of stress and displacement. The simulation result shows that the total warpage has increased a little at the corner of passive die, which is where the critical cracks and crazes were found in our qualification tests. And the Von Mises stresses increase after thermal cycling.

Original language	English
Title of host publication	Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2008) [proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems ; Freiburg im Breisgau, Germany, 20 - 23 April 2008]
Editors	E.J. Ernst
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	361-364
ISBN (Print)	978-1-4244-2127-5
DOIs	https://doi.org/10.1109/ESIME.2008.4525097
Publication status	Published - 2008
Event	9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2008) - Freiburg im Breisgau, Germany Duration: 20 Apr 2008 → 23 Apr 2008

Conference

Conference	9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2008)
Abbreviated title	EuroSimE 2008
Country/Territory	Germany
City	Freiburg im Breisgau
Period	20/04/08 → 23/04/08

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10.1109/ESIME.2008.4525097

Cite this

Ma, X. S., Jansen, K. M. B., Ernst, L. J., Driel, van, W. D., Sluis, van der, O., Zhang, G. Q., Regard, C., Gautier, C., & Fremont, H. (2008). Effect of aging of packaging materials on die surface cracking of a SiP carrier. In E. J. Ernst (Ed.), Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2008) [proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems ; Freiburg im Breisgau, Germany, 20 - 23 April 2008] (pp. 361-364). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ESIME.2008.4525097

Ma, X.S. ; Jansen, K.M.B. ; Ernst, L.J. et al. / Effect of aging of packaging materials on die surface cracking of a SiP carrier. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2008) [proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems ; Freiburg im Breisgau, Germany, 20 - 23 April 2008] . editor / E.J. Ernst. Piscataway : Institute of Electrical and Electronics Engineers, 2008. pp. 361-364

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title = "Effect of aging of packaging materials on die surface cracking of a SiP carrier",

abstract = "Generally, the viscoelastic properties of packaging materials used in the simulation models are obtained from the materials after postcuring. However these properties were observed to change during humidity conditioning and the thermal cycling. Two kinds of packaging materials are tested, one is molding compound and another is underfill. All samples are cured according to the curing procedure, postcured at 180degC. Before the test, first the samples are pre-dried at 125degC for 24 hours and then preconditioned at 60degC/60%RH for 40 hours. Secondly, one reflow at 260degC. Finally, all samples are subjected to thermal cycling. Thermal cycling temperature range is from -65degC to 150degC and every cycle is finished in 30 minutes. For the DMA test, a TA Instrument Q800 is used. Test results show the glass modulus, rubber modulus and glass transition temperature increase with the number of thermal cycles. This change in materials after humidity and thermal treatment is here referred to as aging. The finite element software Marc is used to simulate the internal change of stress and displacement. The simulation result shows that the total warpage has increased a little at the corner of passive die, which is where the critical cracks and crazes were found in our qualification tests. And the Von Mises stresses increase after thermal cycling.",

author = "X.S. Ma and K.M.B. Jansen and L.J. Ernst and {Driel, van}, W.D. and {Sluis, van der}, O. and G.Q. Zhang and C. Regard and C. Gautier and H. Fremont",

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language = "English",

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booktitle = "Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2008) [proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems ; Freiburg im Breisgau, Germany, 20 - 23 April 2008]",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2008), EuroSimE 2008 ; Conference date: 20-04-2008 Through 23-04-2008",

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Ma, XS, Jansen, KMB, Ernst, LJ, Driel, van, WD, Sluis, van der, O, Zhang, GQ, Regard, C, Gautier, C & Fremont, H 2008, Effect of aging of packaging materials on die surface cracking of a SiP carrier. in EJ Ernst (ed.), Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2008) [proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems ; Freiburg im Breisgau, Germany, 20 - 23 April 2008] . Institute of Electrical and Electronics Engineers, Piscataway, pp. 361-364, 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2008), Freiburg im Breisgau, Germany, 20/04/08. https://doi.org/10.1109/ESIME.2008.4525097

Effect of aging of packaging materials on die surface cracking of a SiP carrier. / Ma, X.S.; Jansen, K.M.B.; Ernst, L.J. et al.
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2008) [proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems ; Freiburg im Breisgau, Germany, 20 - 23 April 2008] . ed. / E.J. Ernst. Piscataway: Institute of Electrical and Electronics Engineers, 2008. p. 361-364.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Effect of aging of packaging materials on die surface cracking of a SiP carrier

AU - Ma, X.S.

AU - Jansen, K.M.B.

AU - Ernst, L.J.

AU - Driel, van, W.D.

AU - Sluis, van der, O.

AU - Zhang, G.Q.

AU - Regard, C.

AU - Gautier, C.

AU - Fremont, H.

PY - 2008

Y1 - 2008

N2 - Generally, the viscoelastic properties of packaging materials used in the simulation models are obtained from the materials after postcuring. However these properties were observed to change during humidity conditioning and the thermal cycling. Two kinds of packaging materials are tested, one is molding compound and another is underfill. All samples are cured according to the curing procedure, postcured at 180degC. Before the test, first the samples are pre-dried at 125degC for 24 hours and then preconditioned at 60degC/60%RH for 40 hours. Secondly, one reflow at 260degC. Finally, all samples are subjected to thermal cycling. Thermal cycling temperature range is from -65degC to 150degC and every cycle is finished in 30 minutes. For the DMA test, a TA Instrument Q800 is used. Test results show the glass modulus, rubber modulus and glass transition temperature increase with the number of thermal cycles. This change in materials after humidity and thermal treatment is here referred to as aging. The finite element software Marc is used to simulate the internal change of stress and displacement. The simulation result shows that the total warpage has increased a little at the corner of passive die, which is where the critical cracks and crazes were found in our qualification tests. And the Von Mises stresses increase after thermal cycling.

AB - Generally, the viscoelastic properties of packaging materials used in the simulation models are obtained from the materials after postcuring. However these properties were observed to change during humidity conditioning and the thermal cycling. Two kinds of packaging materials are tested, one is molding compound and another is underfill. All samples are cured according to the curing procedure, postcured at 180degC. Before the test, first the samples are pre-dried at 125degC for 24 hours and then preconditioned at 60degC/60%RH for 40 hours. Secondly, one reflow at 260degC. Finally, all samples are subjected to thermal cycling. Thermal cycling temperature range is from -65degC to 150degC and every cycle is finished in 30 minutes. For the DMA test, a TA Instrument Q800 is used. Test results show the glass modulus, rubber modulus and glass transition temperature increase with the number of thermal cycles. This change in materials after humidity and thermal treatment is here referred to as aging. The finite element software Marc is used to simulate the internal change of stress and displacement. The simulation result shows that the total warpage has increased a little at the corner of passive die, which is where the critical cracks and crazes were found in our qualification tests. And the Von Mises stresses increase after thermal cycling.

U2 - 10.1109/ESIME.2008.4525097

DO - 10.1109/ESIME.2008.4525097

M3 - Conference contribution

SN - 978-1-4244-2127-5

SP - 361

EP - 364

BT - Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2008) [proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems ; Freiburg im Breisgau, Germany, 20 - 23 April 2008]

A2 - Ernst, E.J.

PB - Institute of Electrical and Electronics Engineers

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ER -

Ma XS, Jansen KMB, Ernst LJ, Driel, van WD, Sluis, van der O, Zhang GQ et al. Effect of aging of packaging materials on die surface cracking of a SiP carrier. In Ernst EJ, editor, Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2008) [proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems ; Freiburg im Breisgau, Germany, 20 - 23 April 2008] . Piscataway: Institute of Electrical and Electronics Engineers. 2008. p. 361-364 doi: 10.1109/ESIME.2008.4525097

Effect of aging of packaging materials on die surface cracking of a SiP carrier

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