EDA solutions to new-defect detection in advanced process technologies

E.J. Marinissen, G. Vandling, S.K. Goel, F. Hapke, J. Rivers, N. Mittermaier, S. Bahl

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

2 Citations (Scopus)
16 Downloads (Pure)

Abstract

For decades, EDA test generation tools for digital logic have relied on the Stuck-At fault model, despite the fact that process technologies moved forward from TTL (for which the Stuck-At fault model was originally developed) to nanometer-scale CMOS. Under pressure from their customers, especially in quality-sensitive application domains such as automotive, in recent years EDA tools have made great progress in improving their detection capabilities for new defects in advanced process technologies. For this Hot-Topic Session, we invited the three major EDA vendors to present their recent greatest innovations in hiqh-quality automatic test pattern generation, as well as their lead customers to testify of actual production results.
Original languageEnglish
Title of host publication2012 Design, Automation & Test in Europe Conference & Exhibition (DATE)
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers
Pages123-128
ISBN (Print)978-1-4577-2145-8
DOIs
Publication statusPublished - 2012
Externally publishedYes
Event15th Design, Automation and Test in Europe Conference and Exhibition (DATE 2012) - ICC, Dresden, Germany
Duration: 12 Mar 201216 Mar 2012
Conference number: 15
https://www.date-conference.com/date12/

Conference

Conference15th Design, Automation and Test in Europe Conference and Exhibition (DATE 2012)
Abbreviated titleDATE 2012
Country/TerritoryGermany
CityDresden
Period12/03/1216/03/12
Other
Internet address

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