EDA solutions to new-defect detection in advanced process technologies

E.J. Marinissen; G. Vandling; S.K. Goel; F. Hapke; J. Rivers; N. Mittermaier; S. Bahl

doi:10.1109/DATE.2012.6176444

EDA solutions to new-defect detection in advanced process technologies

E.J. Marinissen, G. Vandling, S.K. Goel, F. Hapke, J. Rivers, N. Mittermaier, S. Bahl

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

2 Citations (Scopus)

23 Downloads (Pure)

Abstract

For decades, EDA test generation tools for digital logic have relied on the Stuck-At fault model, despite the fact that process technologies moved forward from TTL (for which the Stuck-At fault model was originally developed) to nanometer-scale CMOS. Under pressure from their customers, especially in quality-sensitive application domains such as automotive, in recent years EDA tools have made great progress in improving their detection capabilities for new defects in advanced process technologies. For this Hot-Topic Session, we invited the three major EDA vendors to present their recent greatest innovations in hiqh-quality automatic test pattern generation, as well as their lead customers to testify of actual production results.

Original language	English
Title of host publication	2012 Design, Automation & Test in Europe Conference & Exhibition (DATE)
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronics Engineers
Pages	123-128
ISBN (Print)	978-1-4577-2145-8
DOIs	https://doi.org/10.1109/DATE.2012.6176444
Publication status	Published - 2012
Externally published	Yes
Event	15th Design, Automation and Test in Europe Conference and Exhibition, DATE 2012 - ICC, Dresden, Germany Duration: 12 Mar 2012 → 16 Mar 2012 Conference number: 15 https://www.date-conference.com/date12/

Conference

Conference	15th Design, Automation and Test in Europe Conference and Exhibition, DATE 2012
Abbreviated title	DATE 2012
Country/Territory	Germany
City	Dresden
Period	12/03/12 → 16/03/12
Other
Internet address	https://www.date-conference.com/date12/

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date12hottopicFinal author version , 590 KB

Cite this

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title = "EDA solutions to new-defect detection in advanced process technologies",

abstract = "For decades, EDA test generation tools for digital logic have relied on the Stuck-At fault model, despite the fact that process technologies moved forward from TTL (for which the Stuck-At fault model was originally developed) to nanometer-scale CMOS. Under pressure from their customers, especially in quality-sensitive application domains such as automotive, in recent years EDA tools have made great progress in improving their detection capabilities for new defects in advanced process technologies. For this Hot-Topic Session, we invited the three major EDA vendors to present their recent greatest innovations in hiqh-quality automatic test pattern generation, as well as their lead customers to testify of actual production results.",

author = "E.J. Marinissen and G. Vandling and S.K. Goel and F. Hapke and J. Rivers and N. Mittermaier and S. Bahl",

year = "2012",

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publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "15th Design, Automation and Test in Europe Conference and Exhibition, DATE 2012, DATE 2012 ; Conference date: 12-03-2012 Through 16-03-2012",

url = "https://www.date-conference.com/date12/",

}

Marinissen, EJ, Vandling, G, Goel, SK, Hapke, F, Rivers, J, Mittermaier, N & Bahl, S 2012, EDA solutions to new-defect detection in advanced process technologies. in 2012 Design, Automation & Test in Europe Conference & Exhibition (DATE). Institute of Electrical and Electronics Engineers, Piscataway, pp. 123-128, 15th Design, Automation and Test in Europe Conference and Exhibition, DATE 2012, Dresden, Germany, 12/03/12. https://doi.org/10.1109/DATE.2012.6176444

EDA solutions to new-defect detection in advanced process technologies. / Marinissen, E.J.; Vandling, G.; Goel, S.K. et al.

2012 Design, Automation & Test in Europe Conference & Exhibition (DATE). Piscataway : Institute of Electrical and Electronics Engineers, 2012. p. 123-128.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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AU - Vandling, G.

AU - Goel, S.K.

AU - Hapke, F.

AU - Rivers, J.

AU - Mittermaier, N.

AU - Bahl, S.

N1 - Conference code: 15

PY - 2012

Y1 - 2012

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AB - For decades, EDA test generation tools for digital logic have relied on the Stuck-At fault model, despite the fact that process technologies moved forward from TTL (for which the Stuck-At fault model was originally developed) to nanometer-scale CMOS. Under pressure from their customers, especially in quality-sensitive application domains such as automotive, in recent years EDA tools have made great progress in improving their detection capabilities for new defects in advanced process technologies. For this Hot-Topic Session, we invited the three major EDA vendors to present their recent greatest innovations in hiqh-quality automatic test pattern generation, as well as their lead customers to testify of actual production results.

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DO - 10.1109/DATE.2012.6176444

M3 - Conference contribution

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BT - 2012 Design, Automation & Test in Europe Conference & Exhibition (DATE)

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T2 - 15th Design, Automation and Test in Europe Conference and Exhibition, DATE 2012

Y2 - 12 March 2012 through 16 March 2012

ER -

EDA solutions to new-defect detection in advanced process technologies

Abstract

Conference

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