Dynamic compact thermal model extraction for LED packages using model order reduction techniques

Sangye Lungten, Robin Bornoff, James Dyson, Joseph M.L. Maubach, Wil H.A. Schilders, Matt Warner

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

3 Citations (Scopus)

Abstract

Thermal management is one of the key issues arising in designing light-emitting diode (LED) based luminaire products. Dynamic compact thermal models (DCTMs) are required to predict the thermal behaviour of LED packages fast and accurately in system level simulations. The European Delphi4LED consortium aims to develop multi-domain (electrical-thermal-optical) compact models. One of its targets is to develop a methodology to extract DCTMs that can handle multiple heat sources of LEDs. We present the implementation of Krylov subspace based model order reduction techniques to extract the DCTMs of LED packages selected in the Delphi4LED simulation benchmarks. The results presented in this paper show that the extraction of DCTMs using iterative rational Krylov is highly accurate for these benchmark problems.

LanguageEnglish
Title of host publicationTHERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems
Place of PublicationPiscataway
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages1-6
Number of pages6
Volume2017-January
ISBN (Electronic)978-1-5386-1928-5
ISBN (Print)978-1-5386-1929-2
DOIs
StatePublished - Sep 2017
Event23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017 - Amsterdam, Netherlands, Amsterdam, Netherlands
Duration: 27 Sep 201729 Sep 2017

Conference

Conference23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017
CountryNetherlands
CityAmsterdam
Period27/09/1729/09/17

Fingerprint

Model Order Reduction
Thermal Model
Diode
Light emitting diodes
Benchmark
Thermal Management
Krylov Subspace
Heat Source
Simulation
Hot Temperature
Predict
Target
Methodology

Cite this

Lungten, S., Bornoff, R., Dyson, J., Maubach, J. M. L., Schilders, W. H. A., & Warner, M. (2017). Dynamic compact thermal model extraction for LED packages using model order reduction techniques. In THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems (Vol. 2017-January, pp. 1-6). Piscataway: Institute of Electrical and Electronics Engineers (IEEE). DOI: 10.1109/THERMINIC.2017.8233791
Lungten, Sangye ; Bornoff, Robin ; Dyson, James ; Maubach, Joseph M.L. ; Schilders, Wil H.A. ; Warner, Matt. / Dynamic compact thermal model extraction for LED packages using model order reduction techniques. THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. Vol. 2017-January Piscataway : Institute of Electrical and Electronics Engineers (IEEE), 2017. pp. 1-6
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Lungten, S, Bornoff, R, Dyson, J, Maubach, JML, Schilders, WHA & Warner, M 2017, Dynamic compact thermal model extraction for LED packages using model order reduction techniques. in THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. vol. 2017-January, Institute of Electrical and Electronics Engineers (IEEE), Piscataway, pp. 1-6, 23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017, Amsterdam, Netherlands, 27/09/17. DOI: 10.1109/THERMINIC.2017.8233791

Dynamic compact thermal model extraction for LED packages using model order reduction techniques. / Lungten, Sangye; Bornoff, Robin; Dyson, James; Maubach, Joseph M.L.; Schilders, Wil H.A.; Warner, Matt.

THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. Vol. 2017-January Piscataway : Institute of Electrical and Electronics Engineers (IEEE), 2017. p. 1-6.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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Lungten S, Bornoff R, Dyson J, Maubach JML, Schilders WHA, Warner M. Dynamic compact thermal model extraction for LED packages using model order reduction techniques. In THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. Vol. 2017-January. Piscataway: Institute of Electrical and Electronics Engineers (IEEE). 2017. p. 1-6. Available from, DOI: 10.1109/THERMINIC.2017.8233791