Doping of sub-50nm SOI layers

B.J. Pawlak, R. Duffy, M.J.H. Dal, van, F.C. Voogt, R.G.R. Weemaes, F. Roozeboom, P.C. Zalm, Nick Bennett, Nick Cowern

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review


Doping of thin body Si becomes very essential topic due to increasing interest of forming source/drain regions in fully depleted planar silicon-on-isolator (SOI) devices or vertical Fin field-effect-transistors (FinFETs). To diminish the role of the short-channel-effect (SCE) control, the Si layers thicknesses target the 10 nm range. In this paper many aspects of thin Si body doping are discussed: dopant retention, implantation-related amorphization, thin body recrystn., sheet resistance (Rs) and carrier mobility in cryst. or amorphized material, impact of the annealing ambient on Rs for various SOI thicknesses. The complexity of 3D geometry for vertical Fin and the vicinity of the extended surface have an impact on doping strategies that are significantly different than for planar bulk devices.
Original languageEnglish
Title of host publicationDoping engineering for front-end processing : symposium held March 25 - 27, 2008, San Francisco, California, U.S.A.
EditorsB.J. Pawlak, M.L. Pelaz, M. Law
Place of PublicationWarrendale
PublisherMaterials Research Society
ISBN (Print)978-1-605-11040-0
Publication statusPublished - 2008

Publication series

NameMaterials Research Society Symposium Proceedings
ISSN (Print)0272-9172


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